IP Library Patent Application 10980454
Patent Application
App. No. 10/980,454

Bioarray chip reaction apparatus and its manufacture

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Quick Facts
Patent No.
US None
App. No.
10/980,454
Abstract

A body 300 having a cavity 310 for mounting a substrate 120 fabricated with probe sequences at known locations according to the methods disclosed in U.S. Pat. No. 5,143,854 and PCT WO 92/10092 or others, is provided. The cavity includes inlets 350 and 360 for introducing selected fluids into the cavity to contact the probes. Accordingly, a commercially feasible device for use in high throughput assay systems is provided.

Claims (18)

1 . A method of making probe chips comprising the steps of:

forming a plurality of probe arrays on a wafer;

separating said wafer into a plurality of chips, each of said chips comprising at least one probe array thereon; and

mating at least one of said chips to a package, said package comprising a reaction chamber, said reaction chamber comprising inlets for flowing fluid therein, said at least one probe array in fluid communication with said reaction chamber.

2 - 92 . (canceled)

93 . A septum penetrable by a member and which maintains a seal following member penetration in an axial direction and withdrawal, comprising: a first layer of resilient material having first and second opposed surfaces; and a second continuous layer extending across, and bonded to, the first surface of the first layer and which is in radial tension to hold the first layer in radial compression.

94 . A septum according to claim 93 additionally comprising a third layer extending across the second surface of the first layer, which third layer is in radial tension.

95 . A septum according to claim 94 wherein the third layer is continuous.

96 . A septum according to claim 94 wherein each of the second and third layers are under a tension of between 10 2 to 10 6 newton/m 2 .

97 . A septum according to claim 94 wherein each of the second and third layers comprise a resilient material.

98 . A septum according to claim 97 wherein each of the first, second and third layers comprise a resilient polymer.

99 . A septum according to claim 97 wherein each of the first, second and third layers has a thickness of less 10 mm.

100 . A septum according to claim 94 wherein the first layer is held in compression by the second and third layers.

101 . A septum according to claim 100 wherein the first layer is held in a compression of between 5 to 1000 newton/m.

102 . A septum assembly comprising a chamber having a rigid periphery defining an opening into the chamber, and a septum of claim 93 extended across, and supported by, the periphery.

103 . A septum assembly comprising a chamber having a rigid periphery defining an opening into the chamber, and a septum assembly of claim 94 extended across, and supported by, the periphery.

104 . A septum assembly of claim 103 wherein the opening has an area of 0.001 to 100 cm 2 .

105 . A septum assembly of claim 103 wherein the opening has an area of 0.01 cm 2 to 50 cm 2 .