Resin-sealed semiconductor device
View Patent ↗A resin-sealed semiconductor device has a first semiconductor chip whose circuit surface is bonded to a surface of a die pad. The back surface of a second semiconductor chip is bonded to the back surface of the first semiconductor chip. Each of the semiconductor chips is connected by wire to outer lead respectively. A sealing resin is provided for encapsulating the die pad, the first and second semiconductor chips and the wires so that the other surface of the die pad is exposed.
1. A resin-sealed semiconductor device comprising:
a first semiconductor chip having a circuit surface and a back surface opposing to each other;
a die pad having a surface connected to said circuit surface of said first semiconductor chip;
a second semiconductor chip having a circuit surface connected to said back surface of said first semiconductor chip, said second semiconductor chip having a back surface;
wires for connecting each said circuit surface of said semiconductor chips to outer leads having inner ends; and
a sealing resin for encapsulating said first semiconductor chip, said die pad, said other semiconductor chip and said wires so that the other surface of said die pad is exposed.
2. The resin-sealed semiconductor device according to claim 1 , wherein a step is formed on a part of the back surface of said second semiconductor chip.
3. The resin-sealed semiconductor device according to claim 1 , wherein the inner ends of said outer leads are bent to a substantially L-shape.
4. The resin-sealed semiconductor device according to claim 3 , wherein a back portion of the inner ends bent to a substantially L-shape is exposed from said sealing resin to be external terminals.
5. The resin-sealed semiconductor device according to claim 1 , further comprising:
a third semiconductor chip having a circuit surface and an opposing back surface bonded to the back surface of said second semiconductor chip; and
wires for connecting said third semiconductor chip to outer leads.