Rotating sputtering magnetron
View Patent ↗The magnet arrangement and resulting rotating sputtering magnetron design of an embodiment provides magnetic flux density and distribution to penetrate thick production ferrous targets. Further, the magnetic field shape improves target life by more uniformly removing target material.
1. A magnet arrangement comprising
a circular base plate having a rotational axis that is substantially normal to the circular base plate and substantially centered on the circular base plate, the rotational axis being substantially parallel to and offset from a magnetic field axis of the magnet arrangement;
a first magnet coupled to the circular base plate so as to be offset from the magnetic field axis toward the rotational axis, the first magnet having a magnetic field orientation that is substantially radial to the magnetic field axis;
a second magnet positioned about the magnetic field axis, the second magnet having a magnetic field orientation that is parallel to the magnetic field axis; and
a plurality of outer magnets coupled to the circular base plate and surrounding both the first magnet and the second magnet, each of the outer magnets having a magnetic field orientation that is substantially radial to the magnetic field axis.
2. The magnet arrangement of claim 1 wherein each of one or more of the magnets comprises a plurality of component magnets, having substantially the same magnetic field orientation.
3. The magnet arrangement of claim 1 wherein one of the magnets has a different thickness than another of the magnets, the thickness measured in a direction normal to the circular base plate.
4. The magnet arrangement of claim 1 further comprising a non-magnetic counter balance plate coupled to the circular base plate to rotationally balance the magnet arrangement about the rotational axis.
5. A magnet arrangement comprising:
a circular base plate having a rotational axis that is substantially normal to the circular base plate and substantially centered on the circular base plate, the rotational axis being substantially parallel to and offset from a magnetic field axis of the magnet arrangement;
a first magnet coupled to the circular base plate so as to be offset from the magnetic field axis toward the rotational axis, the first magnet having a magnetic field orientation that is substantially radial to the magnetic field axis; and
a plurality of outer magnets coupled to the circular base plate and surrounding the first magnet so as to form a cavity bounded by the first magnet and a selection of the outer magnets, each of the outer magnets having a magnetic field orientation that is substantially radial to the magnetic field axis, the cavity positioned about the magnetic field axis.
6. The magnet arrangement of claim 5 further comprising a metal section in the cavity.
7. The magnet arrangement of claim 6 wherein the metal section comprises steel.
8. The magnet arrangement of claim 5 wherein each of one or more of the magnets comprises a plurality of component magnets having substantially the same magnetic field orientation.
9. The magnet arrangement of claim 5 wherein one of the magnets has a different thickness than another of the magnets, the thickness measured in a direction normal to the circular base plate.
10. The magnet arrangement of claim 5 further comprising a non-magnetic counter balance plate coupled to the circular base plate to rotationally balance the magnet arrangement about the rotational axis.
11. A method comprising:
sputtering, with a magnetron, a ferrous material onto a substrate wherein the magnetron includes a magnet arrangement, the magnet arrangement including
a circular base plate having a rotational axis that is substantially normal to the circular base plate and substantially centered on the circular base plate, the rotational axis being substantially parallel to and offset from a magnetic field axis of the magnet arrangement;
a first magnet coupled to the circular base plate so as to be offset from the magnetic field axis toward the rotational axis, the first magnet having a magnetic field orientation that is substantially radial to the magnetic field axis; and
a plurality of outer magnets coupled to the circular base plate and surrounding the first magnet so as to form a cavity bounded by the first magnet and a selection of the outer magnets, each of the outer magnets having a magnetic field orientation that is radial to the magnetic field axis, the cavity positioned about the magnetic field axis.
12. The method of claim 11 further comprising: shunting, with a shunt disk, a magnetic field generated by the magnetron.
13. The method of claim 12 further comprising:
adjusting, during the sputtering, the distance between the magnet arrangement and the shunt disk.
14. The method of claim 11 further comprising:
adjusting, during the sputtering, the distance between the magnet arrangement and the ferrous target.
15. The method of claim 13 further comprising:
adjusting, during the sputtering, the distance between the magnet arrangement and the ferrous target.
16. A method comprising:
sputtering, with a magnetron, a ferrous material onto a substrate wherein the magnetron includes a magnet arrangement, the magnet arrangement including
a circular base plate having a rotational axis that is substantially normal to the circular base plate and substantially centered on the circular base plate, the rotational axis being substantially parallel to and offset from a magnetic field axis of the magnet arrangement,
a first magnet coupled to the circular base plate so as to be offset from the magnetic field axis toward the rotational axis, the first magnet having a magnetic field orientation that is substantially radial to the magnetic field axis,
a second magnet positioned about the magnetic field axis, the second magnet having a magnetic field orientation that is parallel to the magnetic field axis, and
a plurality of outer magnets coupled to the circular base plate and surrounding both the first magnet and the second magnet, each of the outer magnets having a magnetic field orientation that is substantially radial to the magnetic field axis.
17. The method of claim 16 further comprising:
shunting, with a shunt disk, a magnetic field generated by the magnetron.
18. The method of claim 17 further comprising:
adjusting, during the sputtering, the distance between the magnet arrangement and the shunt disk.
19. The method of claim 16 further comprising:
adjusting, during the sputtering, the distance between the magnet arrangement and the ferrous target.
20. The method of claim 18 further comprising:
adjusting, during the sputtering, the distance between the magnet arrangement and the ferrous target.
21. A method comprising:
sputtering, with a first rotating magnetron, a ferrous material onto a first side of a substrate;
sputtering, with a second rotating magnetron, the ferrous material onto a second side of the substrate, the first rotating magnetron and the second rotating magnetron each comprising a magnet arrangement, the magnet arrangement including
a circular base plate having a rotational axis that is substantially normal to the circular base plate and substantially centered on the circular base plate, the rotational axis being substantially parallel to and offset from a magnetic field axis of the magnet arrangement,
a first magnet coupled to the circular base plate so as to be offset from the magnetic field axis toward the rotational axis, the first magnet having a magnetic field orientation that is substantially radial to the magnetic field axis, and
a plurality of outer magnets coupled to the circular base plate and surrounding the first magnet so as to form a cavity bounded by the first magnet and a selection of the outer magnets, the plurality of outer magnets each having a magnetic field orientation that is substantially radial to the magnetic field axis, the cavity positioned about the magnetic field axis; and
altering the relative rotations of the first rotating magnetron and the second rotating magnetron to alter a magnetic orientation in the sputtered ferrous material.
22. The method of claim 21 further comprising:
rotating the first rotating magnetron and the second rotating magnetron substantially synchronously and substantially 180 degrees out of phases to produce a substantially radial magnetic orientation in the sputtered ferrous material.
23. A method comprising:
sputtering, with a first rotating magnetron, a ferrous material onto a first side of a substrate;
sputtering, with a second rotating magnetron, the ferrous material onto a second side of the substrate, the first rotating magnetron and the second rotating magnetron each comprising a magnet arrangement, the magnet arrangement including
a circular base plate having a rotational axis that is substantially normal to the circular base plate and substantially centered on the circular base plate, the rotational axis being substantially parallel to and offset from a magnetic field axis of the magnet arrangement,
a first magnet coupled to the circular base plate so as to be offset from the magnetic field axis toward the rotational axis, the first magnet having a magnetic field orientation that is substantially radial to the magnetic field axis,
a second magnet positioned about the magnetic field axis, the second magnet having a magnetic field orientation that is parallel to the magnetic field axis, and
a plurality of outer magnets coupled to the circular base plate and surrounding both the first magnet and the second magnet, each of the outer magnets having a magnetic field orientation that is substantially radial to the magnetic field axis; and
altering the relative rotations of the first rotating magnetron and the second rotating magnetron to alter a magnetic orientation in the sputtered ferrous material.
24. The method of claim 23 further comprising:
rotating the first rotating magnetron and the second rotating magnetron substantially synchronously and substantially 180 degrees out of phases to produce a substantially radial magnetic orientation in the sputtered ferrous material.