RF power amplifier and method for packaging the same
View Patent ↗A method and apparatus is provided for use in power amplifiers for reducing the peak voltage that transistors are subjected to. A power amplifier is provided with first and second switching devices and an inductor connected between the switching devices. The switching devices are driven such that the switching devices are turned on and off during the same time intervals.
1. An RF power amplifier suitable for transmitting signals in a mobile telephone system comprising:
a ceramic chip carrier having a top conductive layer, one or more middle conductive layers, and a bottom conductive layer, wherein and the bottom conductive layer is adapted to be mounted to a printed circuit board;
a complimentary metal-oxide semiconductor (CMOS) device, the CMOS device having a plurality of connection points adapted to be mounted to the top conductive layer of the ceramic chip carrier, and wherein the CMOS device and the ceramic chip carrier are packaged together to form the RE power amplifier; and
a plurality of RE amplifier stages, each of the plurality of RE amplifier stages including one or more inductive elements formed in the chip carrier, one or more capacitive elements formed in the CMOS device, and one or more switching devices formed in the CMOS device.
2. The RE power amplifier of claim 1 , further comprising an output matching network having one or more inductive elements formed in the chip carrier, and having one or more capacitive elements.
3. The RE power amplifier of claim 2 , wherein the inductive elements in the output matching network include one or more transformers.
4. The RF power amplifier of claim 2 , wherein the inductive elements from the output matching network are formed as vertical inductors having a loop oriented perpendicular to the layers of the ceramic chip carrier.
5. The RF power amplifier of claim 1 , wherein the inductive elements from the RF amplifier stages are formed as vertical inductors having a loop oriented perpendicular to the layers of the ceramic chip carrier.
6. An RF power amplifier suitable for transmitting signals in a mobile telephone system comprising:
a chip carrier, the chip carrier having an upper surface, one or more conductive layers, and a bottom surface having a plurality of connection points adapted to be mounted to a circuit board;
a complimentary metal-oxide semiconductor (CMOS) device, the CMOS device having a plurality of connection points adapted to be mounted to the upper surface of the chip carrier, wherein the CMOS device and the chip carrier are packaged together to form the RF power amplifier; and
a plurality of tuned RF amplifier stages, each tuned RF amplifier stage further comprising one or more passive elements formed in the chip carrier and one or more active devices formed in the CMOS device.
7. The RF power amplifier of claim 6 , wherein the chip carrier is adapted to be mounted to a printed circuit board by soldering the connection points to the printed circuit board.
8. The RF power amplifier of claim 6 , wherein the one or more passive elements formed in the chip carrier include inductive elements.
9. The RF power amplifier of claim 6 , wherein the one or more passive elements formed in the chip carrier include inductive a transformer.
10. The RF power amplifier of claim 6 , wherein the one or more active elements formed in the CMOS device include switching devices.
11. The RF power amplifier of claim 6 , further comprising a vertically formed inductor is formed on the chip carrier, wherein the vertically formed inductor has a loop oriented perpendicular to the layers of the chip carrier.
12. The RF power amplifier of claim 11 , wherein the vertically formed inductor further comprises a first via extending into the chip carrier, a second via extending into the chip carrier, and a conductive strip connecting the first and second vias.
13. The RF power amplifier of claim 6 , wherein the RF power amplifier is a GSM power amplifier.
14. The RF power amplifier of claim 6 , wherein the chip carrier is a ceramic chip carrier.
15. A method of amplifying signals for a mobile telephone system comprising:
providing a chip carrier having an upper surface, one or more conductive layers, and a bottom surface;
forming a plurality of connection points on the bottom surface of the chip carrier adapted to be mounted to a circuit board;
providing a complimentary metal-oxide semiconductor (CMOS) device;
forming a plurality of connection points on the CMOS device;
mounting the CMOS device to the upper surface of the chip carrier with the plurality of connection points on the CMOS device making electrical contact with the upper surface of the chip carrier; and
forming a plurality of tuned RF amplifier stages, wherein each tuned RF amplifier stage is formed using one or more passive elements formed in the chip carrier and one or more active devices formed in the CMOS device.
16. The method of claim 15 , wherein the chip carrier is adapted to be mounted to a printed circuit board by soldering the connection points to the printed circuit board.
17. The method of claim 15 , wherein the one or more passive elements formed in the chip carrier include inductive elements.
18. The method of claim 15 , wherein the one or more passive elements formed in the chip carrier include a transformer.
19. The method of claim 15 , wherein the one or more active elements formed in the CMOS device include switching devices.
20. The method of claim 15 , wherein the chip carrier is a ceramic chip carrier.