IP Library Granted Patent US 7,397,648
Granted Patent B2
US 7,397,648 · App. 10/985,718 · Granted Jul 8, 2008

Electrostatic chuck including a heater mechanism

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Quick Facts
Patent No.
US 7,397,648
App. No.
10/985,718
Granted
Jul 8, 2008
Kind
B2
Abstract

An electrostatic chuck comprises a main body with a mounting surface and an opposed surface facing away from the mounting surface. At least one chucking electrode extends along the mounting surface of the main body and a first heater layer extends along the opposed surface of the main body. The electrostatic chuck can be used to heat and electrostatic ally attract a work piece, such as a wafer, to a work piece support surface during various processing techniques.

Claims (40)

1. An electrostatic chuck comprising:

a main body encapsulated in an insulating coating layer, said main body comprising a mounting surface, an opposed surface facing away from the mounting surface, and a peripheral surface;

at least one chucking electrode extending along the mounting surface of the main body;

a first heater layer extending along the opposed surface of the main body;

a second heater layer extending along the peripheral surface of the main body;

a plurality of terminals located on said peripheral surface, and

a first heat retainer adapted to inhibit heat transfer away from the main body, wherein the first heat retainer extends along the opposed surface of the main body and comprises a plurality of adjacent disks.

2. The electrostatic chuck of claim 1 for heating a wafer to a temperature of at least 800° C.

3. The electrostatic chuck of claim 2 , wherein said insulating coating layer comprises at least one of a nitride, carbide, carbonitride or oxynitride of elements selected from a group consisting of B, Al, Si, Ga, refractory hard metals, transition metals, and rare earth metals, or complexes and/or combinations thereof.

4. The electrostatic chuck of claim 3 , wherein said main body comprises pyrolytic graphite and said insulating coating layer comprises pyrolytic boron nitride.

5. The electrostatic chuck of claim 1 , further including a second heat retainer adapted to inhibit heat transfer away from the main body, wherein the second heat retainer extends along the peripheral surface of the main body.

6. The electrostatic chuck of claim 5 , wherein the second heat retainer comprises a plurality of rings.

7. The electrostatic chuck of claim 1 , wherein said main body has an inverted cup shape, an inverted bowl shape, or an inverted hat shape.

8. An electrostatic chuck comprising:

a main body encapsulated in an insulating coating layer, said main body comprising a mounting surface and an opposed surface facing away from the mounting surface;

at least one chucking electrode extending along the mounting surface of the main body;

a heater layer extending along the opposed surface of the main body;

and a heat retainer adapted to inhibit heat transfer away from the main body and extending along the opposed surface of the main body, wherein the heat retainer comprises a plurality of adjacent disks.

9. The electrostatic chuck of claim 8 , wherein said insulating coating layer comprises at least one of a nitride, carbide, carbonitride or oxynitride of elements selected from a group consisting of B, Al, Si, Ga, refractory hard metals, transition metals, and rare earth metals, or complexes and/or combinations thereof.

10. The electrostatic chuck of claim 9 , wherein said main body comprises pyrolytic graphite and said insulating coating layer comprises pyrolytic boron nitride.

11. The electrostatic chuck of claim 8 , wherein the heat retainer comprises a heat reflective material.

12. The electrostatic chuck of claim 8 , wherein the heat retainer comprises an insulation material.

13. An electrostatic chuck comprising:

a main body encapsulated in an insulating coating layer, said main body comprising a mounting surface and an opposed surface facing away from the mounting surface; at least one chucking electrode extending along the mounting surface of the main body; a heater layer extending along the opposed surface of the main body; and a heat retainer adapted to inhibit heat transfer away from the main body and extending along the opposed surface of the main body, wherein the heat retainer comprises a ceramic felt insulation material.

14. An electrostatic chuck comprising:

a main body encapsulated in an insulating coating layer, said main body comprising a plate including a mounting surface and an opposed surface facing away from the mounting surface, and a reinforcing member extending away from the plate, wherein the reinforcing member is adapted to inhibit flexing of the plate;

at least one chucking electrode extending along the mounting surface of the plate;

a heater layer extending along the opposed surface of the plate, wherein said insulating coating layer comprises at least one of a nitride, carbide, carbonitride or oxynitride of elements selected from a group consisting of B, Al, Si, Ga, refractory hard metals, transition metals, and rare earth metals, or complexes and or combinations thereof:

wherein the reinforcing member comprises a wall having a first end portion attached to the plate and a second end portion offset from the plate wherein the wall extends from the first end portion to the second end portion

wherein the wall and the plate define an interior cavity

wherein the electrostatic chuck further comprises a heat retainer adapted to inhibit heat transfer away from the main body, wherein the heat retainer is positioned in the interior cavity and extends along the opposed surface of the main body and wherein the heat retainer comprises a plurality of adjacent disks, and each of the plurality of disks includes an outer diameter that is slightly less than a cavity diameter of the interior cavity.

15. The electrostatic chuck of claim 14 , further comprising a first terminal adapted to supply electricity to the chucking electrode and a second terminal adapted to supply electricity to the heater layer, wherein the first and second terminals are each mounted at the second end portion of the wall.

16. The electrostatic chuck of claim 14 , wherein the wall comprises a substantially cylindrical wall and the first end portion of the wall is attached at a peripheral area of the plate.

17. The electrostatic chuck of claim 16 , wherein the cylindrical wall has a substantially circular cross section and the plate comprises a substantially circular plate wherein the first end portion of the wall is attached at a circular peripheral area of the plate.

18. The electrostatic chuck of claim 14 , further comprising a foot having a first end attached to the second end portion of the wall and a second end extending away from the second end portion of the wall.

19. An electrostatic chuck comprising:

a main body encapsulated in an insulating coating layer, said main body comprising a plate including a mounting surface and an opposed surface facing away from the mounting surface, and a reinforcing member extending away from the plate, wherein the reinforcing member is adapted to inhibit flexing of the plate;

at least one chucking electrode extending along the mounting surface of the plate; and

a heater layer extending along the opposed surface of the plate, wherein said insulating coating layer comprises at least one of a nitride, carbide, carbonitride or oxynitride of elements selected from a group consisting of B, Al, Si, Ga, refractory hard metals, transition metals, and rare earth metals, or complexes and/or combinations thereof, wherein the reinforcing member comprises a wall having a first end portion attached to the plate and a second end portion offset from the plate wherein the wall extends from the first end portion to the second end portion, and wherein the wall includes a plurality of apertures adapted to inhibit heat transfer from the first end portion towards the second end portion of the wall.

20. The electrostatic chuck of claim 19 for heating a wafer to a temperature of at least 800° C.

Assignments (25)
PATENT SECURITY AGREEMENT Recorded May 23, 2025
From: MOMENTIVE PERFORMANCE MATERIALS QUARTZ, INC.
To: STANDARD CHARTERED BANK, AS COLLATERAL AGENT AND ADMINISTRATIVE AGENT
Reel/Frame 071368/0854 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Mar 31, 2023
From: BNP PARIBAS
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 063259/0133 →
RELEASE OF SECURITY INTEREST Recorded Mar 30, 2023
From: KOOKMIN BANK NEW YORK
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 063197/0373 →
NUNC PRO TUNC ASSIGNMENT Recorded Feb 4, 2021
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: MOMENTIVE PERFORMANCE MATERIALS QUARTZ, INC.
Reel/Frame 055222/0140 →
RELEASE OF SECURITY INTEREST Recorded Dec 24, 2020
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 054883/0855 →
RELEASE OF SECURITY INTEREST Recorded Nov 11, 2020
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MOMENTIVE PERFORMANCE MATERIALS INC.; MOMENTIVE PERFORMANCE MATERIALS GMBH & CO KG; MOMENTIVE PERFORMANCE MATERIALS JAPAN HOLDINGS GK
Reel/Frame 054387/0001 →
ABL PATENT AGREEMENT Recorded Jun 5, 2019
From: MOMENTIVE PERFORMANCE MATERIALS INC.; MOMENTIVE PERFORMANCE MATERIALS GMBH
To: CITIBANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049388/0252 →
FIRST LIEN TERM LOAN PATENT AGREEMENT Recorded Jun 5, 2019
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: BNP PARIBAS, AS ADMINISTRATIVE AGENT
Reel/Frame 049387/0782 →
SECOND LIEN TERM LOAN PATENT AGREEMENT Recorded Jun 5, 2019
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: KOOKMIN BANK, NEW YORK BRANCH, AS ADMINISTRATIVE AGENT
Reel/Frame 049388/0220 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded May 21, 2019
From: JPMORGAN CHASE BANK, N.A.
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 050304/0555 →
RELEASE OF SECURITY INTEREST Recorded May 15, 2019
From: BOKF, NA
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 049194/0085 →
RELEASE OF SECURITY INTEREST Recorded May 15, 2019
From: BOKF, NA
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 049249/0271 →
NOTICE OF CHANGE OF COLLATERAL AGENT - ASSIGNMENT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Mar 6, 2015
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A. AS COLLATERAL AGENT
To: BOKF, NA, AS SUCCESSOR COLLATERAL AGENT
Reel/Frame 035136/0457 →
NOTICE OF CHANGE OF COLLATERAL AGENT - ASSIGNMENT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY - SECOND LIEN Recorded Mar 6, 2015
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A. AS COLLATERAL AGENT
To: BOKF, NA, AS SUCCESSOR COLLATERAL AGENT
Reel/Frame 035137/0263 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS Recorded Oct 30, 2014
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 034113/0331 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS Recorded Oct 30, 2014
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 034113/0252 →
SECURITY INTEREST Recorded Oct 27, 2014
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 034066/0570 →
SECURITY INTEREST Recorded Oct 27, 2014
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 034066/0662 →
SECURITY AGREEMENT Recorded Apr 29, 2013
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 030311/0343 →
PATENT SECURITY AGREEMENT Recorded Apr 3, 2013
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., THE
Reel/Frame 030185/0001 →
SECURITY AGREEMENT Recorded May 31, 2012
From: MOMENTIVE PERFORMANCE MATERIALS INC
To: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., THE
Reel/Frame 028344/0208 →
SECURITY AGREEMENT Recorded Jul 1, 2009
From: MOMENTIVE PERFORMANCE MATERIALS, INC.; JUNIPER BOND HOLDINGS I LLC; JUNIPER BOND HOLDINGS II LLC; JUNIPER BOND HOLDINGS III LLC; JUNIPER BOND HOLDINGS IV LLC; MOMENTIVE PERFORMANCE MATERIALS CHINA SPV INC.; MOMENTIVE PERFORMANCE MATERIALS QUARTZ, INC.; MOMENTIVE PERFORMANCE MATERIALS SOUTH AMERICA INC.; MOMENTIVE PERFORMANCE MATERIALS USA INC.; MOMENTIVE PERFORMANCE MATERIALS WORLDWIDE INC.; MPM SILICONES, LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL TRUSTEE
Reel/Frame 022902/0461 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 18, 2008
From: GENERAL ELECTRIC COMPANY
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 020823/0266 →
SECURITY AGREEMENT Recorded Jul 3, 2007
From: MOMENTIVE PERFORMANCE MATERIALS HOLDINGS INC.; MOMENTIVE PERFORMANCE MATERIALS GMBH & CO. KG; MOMENTIVE PERFORMANCE MATERIALS JAPAN HOLDINGS GK
To: JPMORGAN CHASE BANK, N.A. AS ADMINISTRATIVE AGENT
Reel/Frame 019511/0166 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2004
From: OTAKA, AKINOBU; YAMAZAKI, KAZUYOSHI
To: GENERAL ELECTRIC COMPANY
Reel/Frame 015986/0054 →