System and method for electrolytic plating

1 . An electrolytic plating system for plating a via in a printed circuit board, comprising:

an electrolytic plating bath;

means for positioning said printed circuit board in said bath; and

means for alternately generating a laminar flow of electrolyte on each side of said printed circuit board.

2 . The electrolytic plating system of claim 1 , wherein said means for alternately generating a laminar flow of electrolyte further comprises a floating shield with a venturi-shaped partition and an aligned partition below said printed circuit board and a plurality of eductors below said floating shield.

3 . The electrolytic plating system of claim 1 , wherein said means for alternately generating a laminar flow of electrolyte further comprises a transport mechanism that moves the floating shield and its partitions from side to side relative to said eductors.

4 . The electrolytic plating system of claim 1 , wherein said means for positioning said printed circuit board in said bath further comprises a vibrator and a system to prevent vibration energy being absorbed by fixed portions of said electrlytic plating system.

5 . An electrolytic plating system for plating a via in a printed circuit board, comprising:

an electrolyte bath;

a support rod above said bath;

a flexible electrical current supply connection attached to said support rod;

at least one printed circuit board clamp attached to said support rod;

a floating shield with v-saddles in contact with said printed circuit board, said floating shield further comprising a venturi-shaped partition;

at least one eductor in a lower portion of said bath below said floating shield for producing a laminar flow of electrolyte across said printed circuit board; and

means for alternating said laminar flow from one side of said printed circuit board to an other side of said printed circuit board.

6 . The electrolytic plating system of claim 5 , further comprising:

an upper rod that supports said support rod;

a vibrator on said upper rod; and

a spring system to mount said upper rod to a rigid structure.

7 . The electrolytic plating system of claim 5 , wherein said floating shield further comprises a partition directly below said printed circuit boards to direct flow of electrolyte to either side of said printed circuit boards.

8 . The electrolytic plating system of claim 7 , wherein said means to alternate said laminar flow comprises a transport mechanism that moves the shield and its partitions from side to side relative to said eductors.

9 . An electrolytic plating system for printed circuit boards comprising:

a plating line supporting said printed circuit boards with a lower support rod;

an upper rod that supports said support rod;

a vibrator on said upper rod; and

a spring system to mount said upper rod to a rigid structure.

10 . An electrolytic plating method for plating a via in a printed circuit board, comprising:

positioning said printed circuit board in an electrolytic bath; and

alternately generating a laminar flow of electrolyte on each side of said printed circuit board.

11 . The electrolytic plating method of claim 10 , wherein the step of alternately generating a laminar flow of electrolyte further comprises:

positioning a floating shield with a venturi-shaped partition and an aligned partition below said printed circuit board; and

operating a plurality of eductors below said floating shield.

12 . The electrolytic plating method of claim 10 , wherein the step of alternately generating a laminar flow of electrolyte further comprises moving a transport mechanism so as to move the floating shield and its partitions from side to side relative to said eductors.

13 . The electrolytic plating method of claim 12 , further comprising the step of supplying vibration energy to said printed circuit board in said bath by mounting a vibrator on said transport mechanism using a system to prevent vibration energy being absorbed by fixed supports.

14 . An electrolytic plating method for plating a via in a printed circuit board, comprising:

providing an electrolyte bath;

positioning a support rod above said bath;

providing electrical current to said support rod;

clamping at least one printed circuit board to said support rod;

transporting said printed circuit board in a floating shield with v-saddles in contact with said printed circuit board, said floating shield further positioning a verituri-shaped partition below said printed circuit board;

producing a laminar flow of electrolyte across said printed circuit board with at least one eductor positioned in a lower portion of said bath below said floating shield; and

alternating said laminar flow from one side of said printed circuit board to another side of said printed circuit board.

15 . The electrolytic plating method of claim 14 , further comprising:

supporting said support rod with an upper rod;

supplying vibration energy to said upper rod; and

isolating said vibration energy from a fixed structure mounted to the upper rod.

16 . The electrolytic plating method of claim 14 , further comprising providing a partition directly below said printed circuit board to direct flow of electrolyte to either side of said printed circuit board.

17 . The electrolytic plating method of claim 16 , wherein moving a transport mechanism moves the shield and its partitions from side to side relative to said eductors to alternate said laminar flow.

18 . An electrolytic plating method for a printed circuit board comprising:

supporting said printed circuit board with a support rod of a plating line;

supporting said support rod with an upper rod;

supplying vibration energy to said upper rod; and

mounting said upper rod to a rigid structure with a system for preventing vibrational energy from being absorbed by the rigid structure.