Off-width pitch for improved circuit card routing

1. A method for providing enlarged spacing between rows of vias in a ball grid array (BGA) multilayered printed wiring board land pattern in which the lands in said pattern are connected to said vias by a link connector comprising:

rotating, elongating, and/or truncating selected consecutive link connectors and rotating their respective corresponding vias in a row or column or selected consecutive rows or columns to achieve said enlarged spacing between rows or columns of vias in said BGA land pattern.

2. The method defined in claim 1 wherein at least two consecutive rows or columns of link connectors and their respective vias are rotated, elongated and/or truncated in mutually opposite directions.

3. A method defined in claim 1 whereby the rotating, elongating and/or truncating is performed in a manner to achieve a wider circuit trace routing channel between adjacent rows or columns of vias.

4. The method defined in claim 1 wherein unusable fractions of routing channels are transferred to a given channel, such that the cumulative sum of said fractions become a usable additional routing channel.

5. A BGA substrate or printed wiring board in which via and link connector pattern has been modified in accordance with the method described in claim 1 .

6. A computer for automating the application of the method defined in claim 1 during layout so as to optimize the resulting routability.