Minimization of cooling air preheat for maximum packaging density
View Patent ↗An electronic hardware cabinet includes a forced-air component positioned to force a stream of air to move through the cabinet and at least two electronic assemblies mounted within the cabinet, each of which includes a heat-generating component. The electronic assemblies are positioned so that a portion of the stream of air is heated by a first one of the heat-generating components and, thereafter, that portion of the stream of air moves toward a second one of the heat-generating components. An airflow diverter is positioned between the electronic assemblies to deflect that portion of the stream of air heated by the first heat-generating component to prevent it from reaching the second heat-generating component.
1. An electronic hardware cabinet comprising:
a forced-air component positioned to force a stream of air to move through the cabinet;
at least two electronic assemblies mounted within the cabinet, where each of the electronic assemblies includes a heat-generating component, and
an airflow-diverter defining an airflow channel around a first heat-generating component on a first of the electronic assemblies,
wherein the airflow diverter is positioned to (i) channel a portion of the stream of air directly over the first heat-generating component, whereby the portion of the stream of air is heated, and (ii) divert the heated portion of the stream of air away from a second heat-generating component on a second of the electronic assemblies.
2. The electronic hardware cabinet of claim 1 , wherein the airflow diverter is positioned to direct the heated portion of the stream of air into a hot-air path in the cabinet.
3. The electronic hardware cabinet of claim 2 , wherein the hot-air path is positioned to one side of the first heat-generating component and at least a portion of the airflow diverter is positioned to the other side of the first heat-generating component, and wherein at least a portion of the airflow diverter tapers toward the hot-air path to direct the heated portion of the stream of air into the hot-air path.
4. The electronic hardware cabinet of claim 2 , wherein the airflow diverter has at least two walls which flank the heat-generating component.
5. The electronic hardware cabinet of claim 4 , wherein at least one of the walls tapers toward the other wall to direct the air into the hot-air path.
6. The electronic hardware cabinet of claim 2 , wherein the hot-air path includes a channel that is formed between at least one of the electronic assemblies and a wall of the cabinet.
7. The electronic hardware cabinet of claim 2 , wherein the cabinet also includes a hot-air exhaust port through which air in the hot-air path exits the cabinet.
8. The electronic hardware cabinet of claim 1 , wherein the airflow diverter is positioned to direct the portion of the stream of air from a cool-air path.
9. The electronic hardware cabinet of claim 8 , wherein the cool-air path includes a channel that is formed between at least one of the electronic assemblies and a wall of the cabinet.
10. The electronic hardware cabinet of claim 8 , where the cabinet also includes a cool-air inlet port through which the portion of the stream of air in the cool-air path enters the cabinet.
11. The electronic hardware cabinet of claim 1 , wherein the airflow diverter is mounted on the first of the electronic assemblies.
12. The electronic hardware cabinet of claim 1 , further comprising:
a third electronic assembly having a third heat-generating component; and
a second airflow diverter positioned to (i) channel a second portion of the stream of air directly over the second heat-generating component, whereby the second portion of the stream of air is heated, and (ii) divert the heated second portion of the stream of air away from a third heat-generating component on third electric assembly.
13. An electronic hardware cabinet comprising:
a forced-air component positioned to force a stream of air to move through the cabinet;
at least two vertically stacked electronic assemblies mounted within the cabinet, where each electronic assembly has at least one heat-generating component, and
an airflow diverter defining a channel around a first heat generating component on a lower electronic assembly, wherein the airflow-diverter is positioned to (i) channel a portion of the stream of air directly over the first heat-generating component, whereby the portion of the stream of air is heated, and (ii) divert the heated portion of the stream of air away from a second heat-generating component on a higher electronic assembly.
14. The cabinet of claim 13 , wherein the airflow diverter is positioned beside the first heat-generating component.
15. The electronic hardware cabinet of claim 13 , wherein the airflow diverter is mounted on the lower electronic assembly.
16. An electronic hardware cabinet comprising:
a forced-air component positioned to force a stream of air to move through the cabinet;
at least two groups of electronic assemblies, including a lower group and a higher group, stacked vertically within the cabinet with one group positioned above the other, wherein each electronic assembly in each group has at least one heat-generating component; and
multiple airflow diverters positioned among the electronic assemblies in the lower group to (i) direct a stream of air directly over each heat-generating component in the lower group, whereby the stream of air is heated, and (ii) divert the heated stream of air away from the heat-generating components in the higher group.
17. The cabinet of claim 16 , where at least some of the airflow diverters are positioned between the electronic assemblies in the lower group.