Method of manufacturing MEMS device
View Patent ↗The present invention provides a method of manufacturing MEMS devices, comprising the steps of forming MEMS device bodies in a first substrate, defining concave portions around the MEMS device bodies over the first substrate, forming convex portions coincident with the concave portions in a second substrate, fitting the convex portions in the concave portions, respectively, to join the first substrate and the second substrate to each other, thereby forming a third substrate, sticking the third substrate to a UV sheet on the second substrate side, and dicing the third substrate to separate the MEMS device bodies from one another.
1. A method of manufacturing MEMS devices, comprising:
forming MEMS device bodies in a first substrate;
defining concave portions around the MEMS device bodies in the first substrate;
forming convex portions in a second substrate, the convex portions positioned to be respectively coincident with the concave portions;
fitting the convex portions in the concave portions, respectively, to join the first substrate and the second substrate to each other, thereby forming a third substrate;
sticking the third substrate to a UV sheet on the second substrate; and
dicing the third substrate to separate the MEMS device bodies from one another,
wherein the second substrate is a silicon substrate, and
wherein in said fitting, the first substrate and the second substrate are bonded to each other by crimping.
2. The method according to claim 1 , wherein said sticking comprises sticking the third substrate to the UV sheet using an adhesive.
3. The method according to claim 1 , wherein said sticking comprises sticking the third substrate to the UV sheet using a bonding material.
4. The method according to claim 1 , wherein said dicing comprises dicing the third substrate along scribe lines.
5. The method according to claim 4 , wherein the MEMS device bodies have different respective scribe lines adjacent thereto.
6. The method according to claim 4 , wherein only a single scribe line is disposed between adjacent MEMS device bodies.
7. The method according to claim 1 , further comprising applying ultraviolet light to the UV sheet.