Touchless TFT panel lamination fixture and process
View Patent ↗A method and apparatus for laminating a TFT panel with a glass support plate without the need to touch an active area of the TFT panel. To accomplish this result, a touchless vacuum lamination chuck secures the TFT panel by its outer margins that do not carry TFTs. To facilitate lamination of the TFT panel, a pressure chamber is formed within the laminating chuck to provide support to the center region of the TFT panel as it is brought into contact with the glass support plate.
1. A method of laminating a relatively thick glass support plate to a relatively thin, rectangular TFT panel, said panel having a front face carrying thin film transistors (TFTs) associated with respective pixel positions over an area that stops short of extending to the edge of the panel on at least 3 edges leaving at least 3 respective peripheral strips of the front face of the panel that are free of TFTs, comprising:
supporting the TFT panel over a cavity in a lamination chuck making physical contact with said peripheral strips of the panel and holding said peripheral strips to the chuck by vacuum suction, positioning the front face of the panel to face the cavity and having a back face of the panel facing away from the cavity;
applying fluid pressure to the cavity, supporting a central portion of the TFT panel so the TFT panel does not bow in toward the cavity;
uniformly applying a UV-curable resin between a front face of the glass support plate and the back face of the TFT panel;
gradually moving the glass support plate and the TFT panel toward each other until the back face of the panel is laminated to the front face of the plate, with said UV-curable resin between the panel and plate; and
curing the resin with UV light to complete the lamination.
2. The method of laminating a relatively thick glass support plate to a relatively thin, rectangular TFT panel as in claim 1 , wherein said applied fluid pressure is gas pressure.
3. The method of laminating a relatively thick glass support plate to a relatively thin, rectangular TFT panel as in claim 1 , wherein said UV curable resin between the panel and the plate has a uniform thickness and is free of bubbles.
4. A method of laminating a relatively thick glass support plate to a relatively thin, rectangular TFT panel, said panel having a front face carrying thin film transistors (TFTs) associated with respective pixel positions over an area that stops short of extending to the edge of the panel on at least 3 edges to thereby leave at least 3 respective peripheral strips of the front face of the panel that are free of TFTs, comprising:
supporting the TFT panel over a cavity in a lamination chuck that makes physical contact with said peripheral strips of the panel and holds said peripheral strips to the chuck by vacuum suction, with the front face of the panel facing the cavity and a back face of the panel facing away from the cavity;
applying fluid pressure to the cavity to force a central portion of the TFT panel to bow out, away from the cavity;
applying UV-curable resin to at least a central portion of at least one of the glass support plate and the TFT panel;
gradually moving the glass support plate and the TFT panel towards each other to initially cause only central areas thereof, at least one of which has said resin thereon, to make contact with the resin and each other and thereafter to gradually spread the resin between the plate and the panel while increasing the area over which resin covered surfaces of the plate and panel make contact, and gradually reducing the gas pressure in the cavity, until the entire back face of the panel is laminated to the plate, with a layer of resin between the panel and plate; and
curing the resin with UV light to complete the lamination.
5. The method of laminating a relatively thick glass support plate to a relatively thin, rectangular TFT panel as in claim 1 , wherein said applied fluid pressure is gas pressure.