Multi-chip module with power system

1. An electronic module, comprising:

a printed circuit board (PCB) having a memory and plural processors;

a power system coupled to and disposed vertically above the PCB;

a thermal dissipation device disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors, wherein the thermal dissipation device has a bottom surface with a surface area that directly contacts a top surface of the processors.

2. The electronic module of claim 1 wherein the thermal dissipation device further dissipates heat, via a direct heat exchange, from the memory.

3. The electronic module of claim 1 wherein the thermal dissipation device directly contacts both the processors and the power system for dissipating heat directly from the processors and power system to the thermal dissipation device.

4. The electronic module of claim 1 wherein the thermal dissipation device has a top surface with a surface area that directly contacts a bottom surface of the power system.

5. The electronic module of claim 4 wherein the surface area of the top surface extends substantially along all of a surface area of the bottom surface of the power system.

6. The electronic module of claim 1 wherein the surface area of the bottom surface extends substantially along all of a surface area of the top surface of the processors.

7. The electronic module of claim 1 comprising two different vertically stacked layers separated from each other, the layers including the PCB as a first layer and the power system as a second layer.

8. The electronic module of claim 1 wherein the thermal dissipation device substantially fills a volume of space formed between a surface area of a top side of the PCB and a surface area of a bottom side of the power system.

9. A method, comprising:

connecting a memory and plural separate processors to a circuit board;

connecting, to form a vertically stacked configuration, a power system board to the circuit board;

providing a thermal dissipation device between the power system board and the circuit board;

dissipating heat from a surface area of the power system board with a first surface of the thermal dissipation device;

dissipating heat from a surface area of the plural processors with a second surface of the thermal dissipation device;

dissipating heat from the plural processors with (i) a direct heat exchange from the plural processors to the thermal dissipation device and (ii) an airflow generated by the thermal dissipation device onto the plural processors.

10. The method of claim 9 further comprising:

dissipating heat from the power system board with (i) a direct heat exchange from the power system board to the thermal dissipation device and (ii) an airflow generated by the thermal dissipation device onto the power system board.

11. A method, comprising:

connecting a memory and plural separate processors to a circuit board;

connecting, to form a vertically stacked configuration, a power system board to the circuit board;

providing a thermal dissipation device between the power system board and the circuit board;

dissipating heat from a surface area of the power system board with a first surface of the thermal dissipation device;

dissipating heat from a surface area of the plural processors with a second surface of the thermal dissipation device;

connecting the power system board, the circuit board, and the thermal dissipation device together to form a rectangular shaped module;

connecting the module to a system board;

removing the module from the system board;

replacing only the power system board; and

re-connecting the module having the replaced power system board to the system board.