Method for forming pattern of stacked film and thin film transistor
View Patent ↗A method for forming a pattern of a stacked film, includes steps (a) to (e). The step (a) is forming sequentially a first base insulating film and a light shielding material on a transparent substrate. The step (b) is patterning the light shielding material to obtain a light shielding film with a first pattern. The step (c) is forming sequentially a second base insulating film, a semiconductor film and a first oxide film on a substrate. The step (d) is forming a resist pattern with a second pattern on the first oxide film. The step (e) is forming a pattern of a stacked film by dry etching the first oxide film and the semiconductor film, above the light shielding film. The stacked film includes the semiconductor film and the first oxide film. The dry etching includes an etching by using an etching gas and the resist pattern as a mask. The semiconductor film includes a taper angle which is controlled to be within predetermined range.
1. A method for forming a pattern of a stacked film, comprising:
(a) forming sequentially a first base insulating film and a light shielding material on a transparent substrate;
(b) patterning said light shielding material to obtain a light shielding film with a first pattern;
(c) forming sequentially a second base insulating film, a semiconductor film and a first oxide film on a substrate;
(d) forming a resist pattern with a second pattern on the first oxide film; and
(e) forming a pattern of a stacked film including said semiconductor film and the first oxide film by dry etching the first oxide film and said semiconductor film, above said light shielding film,
wherein said dry etching includes an etching by using an etching gas and said resist pattern as a mask, and
said semiconductor film includes a taper angle which is controlled to be within predetermined range.
2. The method for forming a pattern of a stacked film according to claim 1 , wherein said etching gas includes a mixture gas of CF 4 and O 2 .
3. The method for forming a pattern of a stacked film according to claim 2 , wherein an O 2 gas ratio of said etching gas is smaller than that of a mixture gas whose gas ratio of CF 4 and O 2 is 100:100.
4. The method for forming a pattern of a stacked film according to claim 3 , wherein said step (e) includes:
(e1) forming said pattern of the stacked film such that said semiconductor film includes said taper angle in the range from 40° to 60°.
5. The method for forming a pattern of a stacked film according to claim 4 , wherein a gas ratio of CF 4 and O 2 of said etching gas is in the range from 110:90 to 120:80.
6. The method for forming a pattern of a stacked film according to claim 5 , wherein said gas ratio of CF 4 and O 2 of said etching gas is approximately 115:85.
7. The method for forming a pattern of a stacked film according to claim 3 , wherein said step (c) includes:
(c1) forming an amorphous silicon film on said second base insulating film, and
(c2) annealing said amorphous silicon film by a laser to obtain a polysilicon film as said semiconductor film.
8. The method for forming a pattern of a stacked film according to claim 3 , wherein said step (c) includes:
(c3) forming an amorphous silicon film on said second base insulating film,
(c4) forming said first oxide film on said amorphous silicon film, and
(c5) annealing said amorphous silicon film by a laser to obtain a polysilicon film as said semiconductor film.
9. The method for forming a pattern of a stacked film according to claim 3 , further comprises:
(f) forming a gate insulating film on said pattern of the stacked film; and
(g) forming wiring on said gate insulating film,
wherein said wiring crossing over said pattern of the stacked film.
10. The method for forming a pattern of a stacked film according to claim 8 , wherein said wiring includes a metal selected from a group consisting of Cr, W, Mo, Ti, Ta and silicide films thereof.