Device for measurement and analysis of electrical signals of an integrated circuit component
According to the invention, one or more external test connection contact points (pads; pins; balls), are provided in an integrated circuit component (chip) ( 1 ), through which signals ( 4, 5, 6 ) that are to be measured or analyzed are selectively fed, e.g. by means of a multiplex circuit ( 7,8 ), and wherein the signals may be connected by means of routes located internally in the component from switch points that are not directly accessible, e.g. points inside the chip ( 15 to 20 ) or covered contact points. The device according to the invention is particularly useful for highly integrated semiconductor chips.
1 . An integrated circuit component, comprising:
a package;
a plurality of contact points for connection to an external component and disposed on said package;
a test contact point for connection to the external component and disposed on said package; and
a multiplexer having an output connected to said test contact point and having a plurality of inputs, each one of said plurality of inputs connected to a respective one of said plurality of contact points.
2 . The integrated circuit according to claim 1 , comprising:
a first set of contact points defined by said plurality of contact points;
a second set of contact points for connection to an external component and disposed on said package;
a first test contact point defined by said test contact point;
a second test contact point for connection to the external component and disposed on said package;
a first multiplexer defined by said multiplexer, each one of said plurality of inputs connected to a respective one of said first set of said plurality of contact points; and
a second multiplexer having an output connected to said second test contact point and having a plurality of inputs, each one of said plurality of inputs of said second multiplexer connected to a respective one of said second set of contact points.
3 . The integrated circuit according to claim 1 , wherein said package is a ball grid array package.