Ink jet printhead chip that incorporates through-wafer ink ejection mechanisms
View Patent ↗An inkjet printhead chip includes a wafer substrate. A drive circuitry layer is positioned on one side of the wafer substrate. The wafer substrate and the drive circuitry layer define a plurality of ink ejection channels that extend between both sides of the wafer substrate. A plurality of nozzle chamber structures is positioned on said one side of the wafer substrate. Each nozzle chamber structure defines a nozzle chamber in fluid communication with a respective ink ejection channel and includes a roof wall positioned on a respective channel opening and defining an ink ejection port in fluid communication with the channel. A wall assembly bounds each channel opening so that the nozzle chamber is defined by the wall assembly and the roof wall. A plurality of ink ejection mechanisms is operatively engaged with respective nozzle chamber structures and is operable to eject ink from the respective nozzle chambers. A plurality of micro-electromechanical actuators is connected to the drive circuitry layer. Each actuator is connected to a respective ink ejection mechanism to act on the ink ejection mechanism on receipt of an electrical signal from the drive circuitry layer.
1. An ink jet printhead chip which comprises
a wafer substrate;
a drive circuitry layer that is positioned on a first side of the wafer substrate, the wafer substrate and the drive circuitry layer defining a plurality of ink ejection channels that extend from the first side of the wafer substrate to a second, opposite, side of the wafer substrate;
a plurality of nozzle chamber structures positioned on said first side of the wafer substrate, each nozzle chamber structure defining a nozzle chamber containing ink in fluid communication with a respective ink ejection channel, each nozzle chamber structure comprising:
a roof wall positioned on a respective channel opening and defining an ink ejection port in fluid communication with the channel; and
a wall assembly that bounds the respective channel opening so that the nozzle chamber is defined by the wall assembly and the roof wall;
a plurality of ink ejection mechanisms operatively engaged with respective nozzle chamber structures and operable to eject the ink contained in the respective nozzle chambers from the respective ink ejection channels at the second side of the wafer substrate; and
a plurality of micro-electromechanical actuators connected to the drive circuitry layer and connected to respective ink ejection mechanisms to operate the ink ejection mechanisms on receipt of an electrical signal from the drive circuitry layer.
2. An ink jet printhead chip as claimed in claim 1 , in which each ink ejection mechanism includes an ink ejection member that partly defines the wall assembly of each nozzle chamber structure and is displaceable towards and away from the wafer substrate to reduce and enlarge a volume of the nozzle chamber so that ink is ejected from the ink ejection port.
3. An ink jet printhead chip as claimed in claim 2 , in which each ink ejection member is an ink ejection paddle that defines a floor of the respective nozzle chamber, the ink ejection paddle being shaped further to define complementary side walls that cooperate with side walls that bound the respective channel opening, the floor and the side walls defining the wall assembly.
4. An ink jet printhead chip as claimed in claim 2 , in which each actuator is a thermal actuating device that includes a deformable body of a material that is capable of thermal expansion to perform work and a heater element connected to the drive circuitry layer and arranged in the body so as to generate differential thermal expansion in the body and thus displacement of the body with respect to the wafer substrate.
5. An ink jet printhead chip as claimed in claim 4 , in which the body is elongate with one end anchored to the substrate and an arm fast with an opposite end, the arm interconnecting said opposite end and the ink ejection member.
6. An ink jet printhead chip as claimed in claim 4 , which includes a plurality of enclosures positioned on said one side of the wafer substrate, each thermal actuating device being positioned in a respective enclosure.
7. An ink jet printhead chip as claimed in claim 1 , in which said one side of the wafer substrate is in fluid communication with an ink reservoir, such that the nozzle chamber structures are positioned in the ink reservoir.