Electronic apparatus for reducing electromagnetic interference
View Patent ↗An electronic apparatus for reducing of EMI (Electromagnetic Interference) in an electronic device is provided. The apparatus includes a socket on a printed circuit board of the apparatus and a metal frame placed beside the printed circuit board for grounding purpose. The socket, inserted with a plug connecting to the electronic device, has at least one pin, and the pin is electronically connected to a conductive object on the printed circuit board. The metal frame has a first protrusion pressing against the conductive object, thereby allowing EMI of the electronic device to be grounded.
1. An electronic apparatus for reducing Electromagnetic Interference (EMI), comprising:
a printed circuit board;
a socket, located on said printed circuit board and having at least one pin;
a conductive object, located on said printed circuit board and electronically connected with said at least one pin; and
a metal frame, placed beside said printed circuit board and having a first protrusion pressed against said conductive object, wherein said metal frame shields said printed circuit board from EMI,
wherein said socket receives a plug for conducting a grounding signal of an electronic device, and said plug is electronically connected with said at least one pin and further electronically connected with said metal frame through said at least one pin and said conductive object, thereby conducting EMI from the electronic device to the ground by said metal frame.
2. The apparatus of claim 1 , wherein said plug is an S-Terminal.
3. The apparatus of claim 1 , wherein said conductive object is made of tin.
4. The apparatus of claim 1 , wherein said metal frame has a surface facing said socket, said surface being formed with an opening used for coupling with said socket.
5. The apparatus of claim 4 , wherein said opening is located above said first protrusion and formed in said metal frame.
6. The apparatus of claim 1 , wherein said metal frame has a second protrusion for use with said first protrusion together to said printed circuit board.
7. The apparatus of claim 6 , wherein said first protrusion and said second protrusion are parallel and integrated into said metal frame.
8. An electronic apparatus for reducing Electromagnetic Interference (EMI), comprising:
a printed circuit board;
a socket, located on said printed circuit board and having at least one pin;
a conductive object, located on said printed circuit board and electronically connected with said at least one pin; and
a metal frame, placed beside said printed circuit board and having a first protrusion pressed against said conductive object, wherein said metal frame shields said printed circuit board from EMI,
wherein said socket receives an S-Terminal of an electronic device, and said S-Terminal is electronically connected with said at least one pin and further electronically connected with said metal frame through said at least one pin and said conductive object, thereby conducting EMI to the ground by said metal frame.
9. The apparatus of claim 8 , wherein said conductive object is made of tin.
10. The apparatus of claim 8 , wherein said metal frame has a surface facing said socket, said surface being formed with an opening used for coupling with said socket.
11. The apparatus of claim 10 , wherein said opening is located above said first protrusion and formed in said metal frame.
12. The apparatus of claim 8 , wherein said metal frame has a second protrusion for use with said first protrusion together to sandwich said printed circuit board.
13. The apparatus of claim 12 , wherein said first protrusion and said second protrusion are parallel and integrated into said metal frame.
14. An electronic apparatus for reducing Electromagnetic Interference (EMI), comprising:
a printed circuit board;
a socket, located on said printed circuit board and having at least one pin;
a conductive object, located on said printed circuit board and electronically connected with said at least one pin; and
a metal frame, placed beside said printed circuit board, said metal frame having a first protrusion pressed against said conductive object and a surface facing said socket, said surface including an opening used for coupling with said socket, wherein said metal frame shields said printed circuit board from EMI,
wherein said socket receives an S-Terminal of an electronic device, and said S-Terminal is electronically connected with said at least one pin and further electronically connected with said metal frame through said at least one pin and said conductive object, thereby conducting EMI to the ground by said metal frame.
15. The apparatus of claim 14 , wherein said opening is located above said first protrusion and formed in said metal frame.
16. The apparatus of claim 14 , wherein said metal frame has a second protrusion for use with said first protrusion together to sandwich said printed circuit board.
17. The apparatus of claim 16 , wherein said first protrusion and said second protrusion are parallel and integrated into said metal frame.