Optoelectronic semiconductor component
View Patent ↗A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.
1. A semiconductor component which performs at least one of a radiation-emitting function and a radiation-receiving function, comprising:
a chip carrier part;
a base body surrounding at least a partial region of the chip carrier part;
a semiconductor chip which performs at least one of a radiation-emitting and radiation-receiving function and which is secured on the chip carrier part, and
a radiation permeable encapsulation covering the semiconductor chip;
said chip carrier part projecting through the underside of said base body and being utilized for at least one of an electrical connection and a thermal connection.
2. The semiconductor component of claim 1 further comprising a trough structure defining a recess around said semiconductor chip and providing a reflective inner surface.
3. The semiconductor component of claim 2 wherein said trough structure is part of said chip carrier part.
4. The semiconductor component of claim 1 wherein said base body is formed of radiation impermeable material.
5. The semiconductor component of claim 1 , further comprising a connection part being arranged at a distance from the chip carrier part and being electrically connected to the semiconductor chip and having at least one external connection which projects from the base body.
6. The semiconductor component of claim 5 , wherein the chip carrier part is electrically connected to the semiconductor chip and comprises at least two external connections that project from the base body.
7. The semiconductor component of claim 6 , wherein the two external connections of the chip carrier part project from the base body at opposite sides.
8. The semiconductor component of claim 1 , wherein the chip carrier part is electrically connected to the semiconductor chip and comprises at least two external connections that project from the base body.
9. The semiconductor component of claim 8 , wherein the two external connections of the chip carrier part project from the base body at opposite sides.
10. The semiconductor component of claim 1 , wherein the chip carrier part projects from a back face of the base body opposite the semiconductor chip.
11. A semiconductor component which performs at least one of a radiation-emitting function and a radiation-receiving function, comprising:
a lead frame having a chip carrier part and a connection part;
a semiconductor chip which performs at least one of a radiation-emitting and radiation-receiving function and which is secured on the chip carrier part; and
an encapsulation covering the semiconductor chip and at least a partial region of the chip carrier part,
wherein the chip carrier part is electrically connected to the semiconductor chip and comprises at least two external connections that project from the encapsulation, and
wherein the connection part is arranged at a distance from the chip carrier part, is electrically connected to the semiconductor chip, and comprises at least one external connection that projects from the encapsulation.
12. The semiconductor component of claim 11 , wherein the two external connections of the chip carrier part project from the encapsulation at opposite sides.
13. The semiconductor component of claim 12 , wherein the connection part comprises at least two external connections that projects from the encapsulation.
14. The semiconductor component of claim 13 , wherein the two external connections of the connection part project from the encapsulation at opposite sides.
15. The semiconductor component of claim 11 , wherein the connection part comprises at least two external connections that projects from the encapsulation.
16. The semiconductor component of claim 11 , wherein said encapsulation further comprises a base body having formed a recess therein and a radiation-permeable window arranged in the recess and wherein the semiconductor chip is positioned within the recess.
17. The semiconductor component of claim 16 , wherein the recess comprises an inner surface that is coated with reflection-enhancing material.
18. The semiconductor component of claim 11 , wherein the encapsulation is formed completely of a radiation-permeable material.
19. The semiconductor component of claim 1 , wherein the radiation permeable encapsulation covers and seals the semiconductor chip.
20. The semiconductor component of claim 11 , wherein the radiation permeable encapsulation covers and seals the semiconductor chip.