Nanoparticle silica filled benzoxazine compositions
View Patent ↗Curable compositions, such as benzoxazine-based ones, are useful in applications within the aerospace industry, such as for example as a heat curable composition for use as a matrix resin or an adhesive, and form the basis of the present invention.
1. A heat curable composition comprising:
(a) a benzoxazine component comprising one or more of
wherein o is 1-4, X is selected from the group consisting of the group consisting of a direct bond (when o is 2), alkyl (when o is 1), alkylene (when o is 2-4), carbonyl (when o is 2), thiol (when o is 1), thioether (when o is 2), sulfoxide (when o is 2), and sulfone (when o is 2), R 1 is selected from the group consisting of hydrogen, alkyl, and aryl, and R 4 is selected from hydrogen, halogen, alkyl, and alkenyl, or
wherein p is 1-4, Y is selected from the group consisting of biphenyl (when p is 2), diphenyl methane (when p is 2) and derivatives thereof, diphenyl isopropane (when p is 2), diphenyl sulfide (when p is 2), diphenyl sulfoxide (when p is 2), diphenyl sulfone (when p is 2), and diphenyl kerone (when p is 2), and R 4 is selected from the group consisting of hydrogen, halogen, alkyl and alkenyl; and
(b) a silica nanoparticle reinforced epoxy resin component, wherein said epoxy resin is selected from the group consisting of a cycloaliphatic epoxy resin matrix, a bisphenol A epoxy resin matrix, and a bisphenol F epoxy resin matrix; wherein said silica nanoparticle reinforced epoxy resin component is present in an amount of from 3 to 30% by weight of the total composition.
2. The heat curable composition of claim 1 , wherein the benzoxazine component comprises one or more of
wherein X is selected from the group consisting of a direct bond, CH 2 , C(CH 3 ) 2 , C═O, S, S═O and O═S═O, and R 1 , R 2 , R 3 and R 4 are the same or different and are selected from the group consisting of hydrogen, alkyl, alkenyl and aryl.
3. The heat curable composition of claim 1 , wherein the benzoxazine component comprises one or more of
4. The heat curable composition of claim 1 , wherein the benzoxazine component comprises
wherein R 1 and R 2 are the same or different and are selected from the group consisting of methyl, ethyl, propels and butyls.
5. The heat curable composition of claim 1 , wherein the benzoxazine component is present in an amount in the range of about 10 to about 99 percent by weight, based on the total weight of the composition.
6. The heat curable composition of claim 1 , wherein the silica component is present in an amount In the range of about 1 to about 60 percent by weight, based on the total weight of the composition.
7. An adhesive composition comprising the heat curable composition of claim 1 .
8. The adhesive composition of claim 7 , further comprising one or more of an adhesion promoter, a flame retardant, a filler, a thermoplastic material, a reactive or unreactive diluent, and a thixotrope.
9. Cured reaction products of the adhesive composition of claim 7 .
10. An adhesive film comprising the heat curable composition of claim 1 .
11. The adhesive film of claim 10 , further comprising a support selected from the group consisting of nylon, glass, carbon, polyester, polyalkylene, quartz, polybenzimidazole, polyetheretherketone, polyphenylene sulfide, poly p-phenylene benzobisoxazole and silicon carbide.
12. Cured reaction product of the adhesive film of claim 11 .
13. A syntactic composition comprising the heat curable composition:
(a) a benzoxazine component comprising one or more of
wherein o is 1-4, X is selected from the group consisting of the group consisting of a direct bond (when o is 2), alkyl (when o is 1), alkylene (when o is 2-4), carbonyl (when o is 2), thiol (when o is 1), thioether (when o is 2), sulfoxide (when o is 2), and sulfone (when o is 2), R 1 is selected from the group consisting of hydrogen, alkyl, and aryl, and R 4 is selected from hydrogen, halogen, alkyl, and alkenyl, or
wherein p is 1-4, Y is selected from the group consisting of biphenyl (when p is 2), diphenyl methane (when p is 2) and derivatives thereof, diphenyl isopropane (when p is 2), diphenyl sulfide (when p is 2), diphenyl sulfoxide (when p is 2), diphenyl sulfone (when p is 2), and diphenyl ketone (when p is 2), and R 4 is selected from the group consisting of hydrogen, halogen, alkyl and alkenyl; and
(b) a silica nanoparticle reinforced epoxy resin component, wherein said epoxy resin is selected from the group consisting of a cycloaliphatic epoxy resin matrix, a bisphenol A epoxy resin matrix, and a bisphenol F epoxy resin matrix; wherein said silica nanoparticle reinforced epoxy resin component is present in an amount of from 3 to 30% by weight of the total composition.
14. A prepreg comprising the heat curable composition of claim 1 .
15. A towpreg comprising the heat curable composition of claim 1 .
16. A process for producing a heat curable composition, steps of which comprise:
(a) providing a benzoxazine composition comprising
wherein o is 1-4, X is selected from the group consisting of the group consisting of a direct bond (when o is 2), alkyl (when o is 1), alkylene (when o is 2-4), carbonyl (when o is 2), thiol (when o is 1) thioether (when o is 2), sulfoxide (when o is 2), and sulfone (when o is 2), R 1 is selected from the group consisting of hydrogen, alkyl, and aryl, and R 4 is selected from the group consisring of hydrogen, halogen, alkyl, and alkenyl, or
wherein p is 1-4, Y is selected from the group consisting of biphenyl (when p is 2), diphenyl methane (when p is 2) and derivatives thereof, diphenyl isopropane (when p is 2), diphenyl sulfide (when p is 2), diphenyl sulfoxide(when p is 2), diphenyl sulfone (when p is 2), and diphenyl ketone (when p is 2), and R 4 is selected from the group consisting of hydrogen, halogen, alkyl and alkenyl; and
(b) providing with mixing a silica nanoparticle reinforced epoxy resin component, wherein said epoxy resin is selected from the group consisting of a cycloaliphatic epoxy resin matrix, a bisphenol A epoxy resin matrix, and a bisphenol F epoxy resin matrix; and wherein said silica nanoparricles are pre-dispersed in the epoxy resin; and
(c) mixing the benzoxazine composition of (a) and the silica component of (b) under conditions appropriate to produce the heat curable composition.
17. The composition according to claim 1 , further comprising (c) a cycloaliphatic epoxy.
18. The composition according to claim 17 , further comprising (d) a component containing the structure:
19. The process according to claim 16 , wherein the benzoxazine composition further comprises a cycloaliphatic epoxy and a component containing the structure: