Cooling apparatus for vertically stacked printed circuit boards
View Patent ↗An apparatus, system and method for cooling vertically stacked printed circuit boards (PCBs). In one embodiment, a first PCB is disposed within a substantially enclosed lower chamber inside a PCB containment housing. A second PCB is disposed above the first PCB within the housing to define a substantially enclosed upper chamber above the lower chamber. The second PCB includes one or more airflow apertures defined therethrough and providing vertical air flow coupling between the upper and lower chambers. An airflow actuating device is utilized to generate a primary forced airflow within the upper chamber which is substantially parallel to the surface plane of the second PCB. The primary forced airflow further induces a negative air pressure in the upper chamber such that a mixed convection airflow is established between the upper and lower chambers via the second PCB apertures.
1. An apparatus for cooling vertically stacked printed circuit boards (PCBs) comprising:
a first PCB disposed within a containment unit;
a second PCB disposed vertically above said first PCB and defining the boundary between a substantially enclosed upper chamber and a substantially enclosed lower chamber within the containment unit, said second PCB having one or more airflow apertures providing vertical air flow coupling between said upper and lower chambers, wherein the airflow apertures are distributed substantially the length of the second PCB along the direction of the primary forced airflow; and
an airflow actuating device for generating a primary forced airflow within said upper chamber.
2. The apparatus of claim 1 , wherein said airflow actuating device is a fan or blower device.
3. The apparatus of claim 2 , further comprising one or more air inlet apertures disposed in opposition to said fan or blower.
4. The apparatus of claim 1 , wherein said airflow actuating device is disposed relative to said upper chamber such that the primary forced airflow is substantially directed is parallel to the upper surface of said first PCB.
5. The apparatus of claim 1 , wherein said airflow actuating device and said second PCB are mutually oriented such that the primary forced airflow induces a negative air pressure in said upper chamber such that a mixed convection airflow is induced through said one or more apertures from said lower chamber to said upper chamber.
6. A method for cooling vertically stacked printed circuit boards (PCBs), said method comprising:
positioning a first PCB within a containment unit;
positioning a second PCB above the first PCB within the containment unit to define a substantially enclosed upper chamber and a substantially enclosed lower chamber, said second PCB defining the boundary between the upper and lower chambers and having one or more airflow apertures providing vertical air flow coupling between the upper and lower chambers, wherein the airflow apertures are distributed substantially the length of the second PCB along the direction of the induced primary forced airflow; and
inducing a primary forced airflow within the upper chamber.
7. The method of claim 6 , wherein said inducing a primary forced airflow comprises actuating a fan or blower device mounted on one end of the upper chamber.
8. The method of claim 6 , wherein an airflow actuator device is utilized for inducing a primary forced airflow within the upper chamber, said method further comprising positioning the airflow actuating device relative to the upper chamber such that the primary forced airflow is substantially directed in parallel to the upper surface of said first PCB.
9. The method of claim 6 , further comprising mutually positioning the airflow actuating device and the second PCB such that the primary forced airflow induces a negative air pressure in the upper chamber such that a mixed convection airflow is induced through said one or more apertures from said lower chamber to said upper chamber.