Polycrystalline diamond abrasive elements
View Patent ↗A polycrystalline diamond abrasive element, particularly a cutting element, comprises a layer of polycrystalline diamond having a working surface and bonded to a substrate, particularly a cemented carbide substrate, along an interface. The polycrystalline diamond abrasive element is characterized by using a binder phase that is homogeneously distributed through the polycrystalline diamond layer and that is of a fine scale. The polycrystalline diamond also has a region adjacent the working surface lean in catalyzing material and a region rich in catalyzing material.
1. A polycrystalline diamond abrasive element, comprising:
a layer of polycrystalline diamond comprising a binder phase comprising catalyzing material, and
a substrate,
wherein said layer of the polycrystalline diamond comprises
a working surface and is bonded to the substrate along an interface,
a region adjacent said working surface which is lean in the catalyzing material, and
a region rich in the catalyzing material,
wherein said region rich in the catalyzing material comprises
said binder phase homogeneously distributed through the rich region, and
a fine scale of the binder phase distribution,
wherein the binder phase distribution is expressed in terms of an equivalent circle diameter, the standard deviation of the distribution of equivalent circle diameters, expressed as a percentage of the average equivalent circle diameter, is less than 80%, and
wherein the layer of the polycrystalline diamond comprises diamond particles having an average particle grain size of less than 20 microns.
2. The polycrystalline diamond abrasive element according to claim 1 , wherein the standard deviation of the distribution of equivalent circle diameters, expressed as a percentage of the average equivalent circle diameter, is less than 70%.
3. The polycrystalline diamond abrasive element according to claim 1 , wherein the standard deviation of the distribution of equivalent circle diameters, expressed as a percentage of the average equivalent circle diameter, is less than 60%.
4. The polycrystalline diamond abrasive element according to claim 1 , wherein the layer of the polycrystalline diamond comprises the diamond particles having an average particle grain size of less than 15 microns.
5. The polycrystalline diamond abrasive element according to claim 4 , wherein the layer of the polycrystalline diamond comprises the diamond particles having an average particle grain size of less than 11 microns.
6. The polycrystalline diamond abrasive element according to claim 1 , wherein the polycrystalline diamond abrasive element has a wear ratio-of less than 50%.
7. The polycrystalline diamond abrasive element according to claim 6 , wherein the polycrystalline diamond abrasive element has a wear ratio of less than 40%.
8. The polycrystalline diamond abrasive element according to claim 7 , wherein the polycrystalline diamond abrasive element has a wear ratio of less than 30%.
9. The polycrystalline diamond abrasive element according to claim 1 , wherein the layer of the polycrystalline diamond is produced from a mass of diamond particles having at least three different average particle sizes.
10. The polycrystalline diamond abrasive element according to claim 9 , wherein the layer of the polycrystalline diamond is produced from a mass of diamond particles having at least five different average particle sizes.
11. The polycrystalline diamond abrasive element according to claim 1 , which is a cutting element.
12. The polycrystalline diamond abrasive element according to claim 1 , wherein the substrate is a cemented carbide substrate.
13. The polycrystalline diamond abrasive element according to claim 1 , wherein the region lean in catalyzing material extends into the layer of the polycrystalline diamond from the working surface to a depth of from about 30 microns to about 500 microns.
14. The polycrystalline diamond abrasive element according to claim 13 , wherein the region lean in catalyzing material extends to a depth of from about 60 microns to about 350 microns.
15. The polycrystalline diamond abrasive element according to claim 1 , wherein the working surface of the layer of the polycrystalline diamond defines a cutting edge that is beveled.
16. The polycrystalline diamond abrasive element according to claim 15 , wherein the region lean in catalyzing material follows the beveled cutting edge.
17. The polycrystalline diamond abrasive element of claim 1 , wherein the region rich in the catalyzing material extends from the region lean in the catalyzing material to the interface with the substrate.
18. The polycrystalline diamond abrasive element of claim 1 , wherein a difference between the average particle sizes of the diamond particles of the layer of the polycrystalline diamond is not more than 25 μm.