Flat panel display device and method of fabricating the same

1. A flat panel display device, comprising:

a substrate;

a semiconductor layer located on the substrate;

a gate electrode located on the semiconductor layer;

an interlayer located on the gate electrode and the semiconductor layer and having a source/drain contact hole that exposes an end part of the semiconductor layer; and

source/drain electrodes including at least a heat-resistant metal layer pattern, an Al-based metal layer pattern on the heat-resistant metal layer pattern, and a capping metal layer pattern on the Al-based metal layer pattern, deposited on the substrate,

wherein the heat-resistant metal layer pattern, the Al-based metal layer pattern and the capping metal layer pattern are located on the exposed semiconductor layer, the heat-resistant metal layer pattern being arranged directly on the exposed semiconductor layer and comprising at least one metal layer selected from a group of a Cr layer, a Cr alloy layer, a Mo layer, and a Mo alloy layer, and

wherein the heat-resistant metal layer pattern and the capping metal layer pattern are formed of different material.

2. The flat panel display device of claim 1 , wherein the heat-resistant metal layer pattern comprises a MoW alloy layer.

3. The flat panel display device of claim 1 , wherein the Al-based metal layer pattern comprises at least one metal layer selected from a group of an Al layer, an AlSi layer, an AlNd layer, and an AlCu layer.

4. The flat panel display device of claim 3 , wherein the Al-based metal layer pattern comprises an AlSi layer.

5. The flat panel display device of claim 1 , wherein the capping metal layer pattern comprises either a Ti layer or Ta layer.

6. The flat panel display device of claim 1 , further comprising:

a diffusion barrier pattern interposed between the heat-resistant metal layer pattern and the Al-based metal layer pattern.

7. The flat panel display device of claim 6 , wherein the diffusion barrier pattern comprises either a Ti layer or a Ta layer.

8. The flat panel display device of claim 1 , wherein the heat-resistant metal layer pattern is at least about 1000 Å thick.

9. A flat panel display device, comprising:

a substrate;

a semiconductor layer located on the substrate;

a gate electrode located on the semiconductor layer;

an interlayer located on the gate electrode and the semiconductor layer and having a source/drain contact hole that exposes an end part of the semiconductor layer; and

source/drain electrodes including at least a heat-resistant metal layer pattern;

an Al-based metal layer pattern on the heat-resistant metal layer pattern, and

a capping metal layer pattern on the Al-based metal layer pattern, deposited on a substrate; and

a diffusion barrier pattern interposed between the heat-resistant metal layer pattern and the Al-based metal layer pattern,

wherein the heat-resistant metal layer pattern is about 500 Å or less thick the heat-resistant metal layer pattern being arranged directly on the exposed semiconductor layer and comprising at least one metal layer selected from a group of a Cr layer, a Cr alloy layer, a Mo layer, and a Mo alloy layer.

10. The flat panel display device of claim 1 , wherein the semiconductor layer comprises a polysilicon layer.

11. The flat panel display device of claim 9 , wherein the heat-resistant metal layer pattern comprises a MoW alloy layer.

12. The flat panel display device of claim 9 , wherein the Al-based metal layer pattern comprises at least one metal layer selected from a group of an Al layer, an AlSi layer, an AlNd layer, and an AlCu layer.

13. The flat panel display device of claim 12 , wherein the Al-based metal layer pattern comprises an AlSi layer.

14. The flat panel display device of claim 9 , wherein the capping metal layer pattern comprises either a Ti layer or Ta layer.

15. The flat panel display device of claim 9 , wherein the diffusion barrier pattern comprises either a Ti layer or a Ta layer.