Method for manufacturing semiconductor device
A heat treatment is performed to an insulating film composition, formed on a semiconductor substrate, at a temperature of 350° C. in an inert gas ambient to form a non-porous insulating film. Next, dry etching is performed using a resist pattern as a mask to form a trench in the non-porous insulating film, ashing is performed to remove the resist pattern, and the surface of the semiconductor substrate is cleaned. Thereafter, a second heat treatment is performed for the non-porous insulating film to form a porous insulating film. Since the second heat treatment is performed in an oxidizing-gas atmosphere, the pore-generating material can be removed at a temperature lower than the temperature of conventional methods to form an insulating film having a low dielectric constant.
1. A method of manufacturing a semiconductor device comprising:
applying an insulating film composition containing an insulating film precursor and a pore-generating material onto a semiconductor substrate;
first heat treating said insulating film composition at a first temperature, not exceeding 350° C., in an inert-gas ambient to polymerize said insulating film precursor and form a non-porous film;
forming a chemical mechanical polishing (CMP) stopper film on said non-porous insulating film;
forming a resist pattern on said CMP stopper film;
dry etching said CMP stopper film and said non-porous insulating film using said resist pattern as a mask to form a trench in said non-porous insulating film;
removing said resist pattern by ashing;
cleaning said semiconductor substrate after the ashing;
after the cleaning, second heat treating said non-porous insulating film at a second temperature that is no higher than the first temperature in an oxidizing-gas ambient, removing said pore-generating material from said non-porous insulating film, thereby forming a porous insulating film;
forming a barrier metal film on said CMP stopper film and on inner surfaces of said trench;
forming a copper layer on said barrier metal film, filling said trench; and
polishing said copper layer and said barrier metal film by CMP, thereby forming a copper wiring.
2. The method of manufacturing a semiconductor device according to claim 1 , wherein if the first temperature is T 1 and duration of the first heat treating is t 1 , and the second temperature is T 2 and duration of the second heat treating is t 2 , then:
300° C.≦T 1 ≦400° C.,
250° C.≦T 2 ≦350° C.,
and
t 1 =t 2 .
3. The method manufacturing a semiconductor device according to claim 1 , including performing the ashing in a reducing ambient containing hydrogen.
4. The method manufacturing a semiconductor device according to claim 1 , wherein said porous insulating film is selected from the group consisting of a methyl silsesquioxane film, an hydrogenated silsesquioxane film, an organic-inorganic hybrid film, a polyimide derivative film, a polyarylether derivative film, a polyquinone derivative film, and a polyparaxylene derivative film.