IP Library › Patent Application 11010559
Patent Application
App. No. 11/010,559

Method and device for coating a substrate

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Quick Facts
Patent No.
US None
App. No.
11/010,559
Abstract

Apparatus and methods for coating a substrate. In an exemplary embodiment, the apparatus are used to create a metallized substrate for use as an EMI/RFI shield. The apparatus typically includes a movable processing apparatus that is movable orthogonal to the substrate to treat the substrate. The processing apparatus can include a surface preparation assembly, a heating assembly, a thermoforming assembly, a metallizing assembly, a cutting assembly, or the like.

Claims (11)

1 .- 31 . (canceled)

32 . A method of manufacturing a EMI shield, the method comprising:

positioning a substrate on a support;

moving a processing apparatus adjacent to the substrate;

depositing a metal layer on the substrate; and

moving the processing apparatus away from the substrate.

33 . The method of claim 32 further comprising creating a vacuum around at least a portion of the substrate.

34 . The method of claim 32 further comprising moving the substrate along the support.

35 . The method of claim 32 further comprising shaping the substrate before depositing the metal layer.

36 . The method of claim 35 wherein depositing requires rotating a processing apparatus to rotate a shaping module away from the substrate and a metal depositing module toward the substrate.

37 . The method of claim 35 comprising cutting the shaped substrate after depositing the metal layer.