IP Library Granted Patent US 7,194,375
Granted Patent B2
US 7,194,375 · App. 11/011,065 · Granted Mar 20, 2007

Pressure sensor

Assignee: Toyoda Koki Kabushiki Kaisha
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Quick Facts
Patent No.
US 7,194,375
App. No.
11/011,065
Granted
Mar 20, 2007
Kind
B2
Abstract

A pressure sensor 11 is provided with a connecter housing 30 having a pressure sensing element 20 arranged on an end surface thereof, a sensor housing 40 constructed to have the connecter housing 30 inserted thereinto, a pressure chamber 452 defined between the end surface of the connecter housing 30 and the sensor housing 40 , and a compensation circuit 21 for performing the processing and operation of a measured signal of the pressure sensing element 20 to output the measured signal. The compensation circuit 21 is composed of a data communication interface section 211 for receiving the compensation data radio-transmitted thereto, a memory section 212 for storing the compensation data, a compensation data writing section 214 for taking thereinto the compensation data from the data communication interface section 211 and for writing the compensation data in the memory section 212 , and a signal processing section 213 for performing the processing and operation of the measured signal based on the compensation data stored in the memory section 212.

Claims (28)

1. A pressure sensor having a pressure sensing element for measuring the magnitude of a pressure acting thereon and a pressure chamber for accommodating the pressure sensing element therein, the pressure sensor further comprising:

an annular induction coil;

a first communication interface section configured to receive a radio-transmitted measured signal of the pressure sensing element, the annular induction coil and the first communication interface section being provided independently of the pressure chamber;

a secondary coil adapted to be magnetically connected to the induction coil; and

a second communication interface section configured to radio-transmit the measured signal of the pressure sensing element, the secondary coil and the second communication interface section being arranged in the pressure chamber.

2. The pressure sensor as set forth in claim 1 , further comprising:

a compensation circuit arranged in the pressure chamber and including

(a) a memory section configured to store compensation data;

(b) a compensation data writing section configured to write the compensation data in the memory section, and

(c) a signal processing section configured to perform the processing and operation of the measured signal based on the compensation data stored in the memory section; and

the second communication interface section is further configured to receive the compensation data by radio transmission and write compensation data in the compensation data writing section.

3. The pressure sensor as set forth in claim 2 , further comprising:

a fuse section arranged on an electric power supply path and configured to supply the compensation data writing section with operating electric power from the secondary coil and to be melted and cut when supplied with the electric power having a magnitude equal to or greater than a predetermined value.

4. The pressure sensor as set forth in claim 3 , further comprising:

a connecter housing holding the pressure sensing element, and including a synthetic resin formed around the induction coil and the first communication interface section;

a sensor housing into which the connecter housing is configured to be inserted; and

the pressure chamber defined between the connecter housing and the sensor housing.

5. The pressure sensor as set forth in claim 3 , wherein the pressure chamber is fluid-tightly sealed with a seal diaphragm and is filled with a pressure transmission medium.

6. The pressure sensor as set forth in claim 2 , further comprising:

a connecter housing holding the pressure sensing element, and including a synthetic resin formed around the induction coil and the first communication interface section;

a sensor housing into which the connecter housing is configured to be inserted; and

the pressure chamber defined between the connecter housing and the sensor housing.

7. The pressure sensor as set forth in claim 2 , wherein the pressure chamber is fluid-tightly sealed with a seal diaphragm and is filled with a pressure transmission medium.

8. The pressure sensor as set forth in claim 1 , further comprising:

a connecter housing holding the pressure sensing element, and including a synthetic resin formed around the induction coil and the first communication interface section;

a sensor housing into which the connecter housing is configured to be inserted and

the pressure chamber defined between the connecter housing and the sensor housing.

9. The pressure sensor as set forth in claim 1 , wherein the pressure chamber is fluid-tightly sealed with a seal diaphragm and is filled with a pressure transmission medium.

Assignments (2)
MERGER Recorded Mar 21, 2007
From: TOYODA KOKI KABUSHIKI KAISHA
To: JTEKT CORPORATION
Reel/Frame 019060/0838 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2004
From: YAMAKAWA, TOMONARI
To: TOYODA KOKI KABUSHIKI KAISHA
Reel/Frame 016092/0494 →
Priority Claims (1)
JP 2003-427748 · Dec 24, 2003 · national
Continuity (1)
Related Publication 20050139011A1 · Jun 30, 2005