IP Library Granted Patent US 7,229,150
Granted Patent B2
US 7,229,150 · App. 11/011,148 · Granted Jun 12, 2007

Printhead for modular printhead assembly

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Quick Facts
Patent No.
US 7,229,150
App. No.
11/011,148
Granted
Jun 12, 2007
Kind
B2
Abstract

A printhead module for a printhead assembly incorporating a number of modules spaced across a pagewidth in a drop on demand ink jet printer includes a first micro-molding and a second micro-molding separated by a mid-package film layer. The mid-package film layer has laser ablated holes and an adhesive layer on both faces providing adhesion between the first micro-molding, the mid-package film layer and the second micro-molding. The first and second micro-moldings are held in alignment by pins passing through corresponding apertures in the mid-package film layer. Ink inlets and an air inlet are provided in the underside of the second micro-molding. Ink and air passes from the second micro-molding, through the mid-package film layer to the first micro-molding. Air exits the first micro-molding to repel the print media from the printhead during printing. The ink passes from the first micro-molding into individual print chips mounted therein.

Claims (19)

1. A printhead assembly incorporating at least one module comprising:

a first micro-molding locating a print chip having a plurality of ink jet nozzles, the first micro-molding having ink channels delivering ink to said print chip,

a second micro-molding having inlets through which ink is received from a source of ink, and

a mid-package film adhered between said first and second micro-moldings and having holes through which ink passes from the second micro-molding to the first micro-molding.

2. The printhead assembly of claim 1 wherein the mid-package film is made of an inert polymer.

3. The printhead assembly of claim 1 wherein the holes of the mid-package film are laser ablated.

4. The printhead assembly of claim 1 wherein the mid-package film has an adhesive layer on opposed faces thereof, providing adhesion between the first micro-molding, the mid-package film and the second micro-molding.

5. The printhead assembly of claim 1 wherein the first micro-molding has an alignment pin passing through an aperture in the mid-package film and received within a recess in the second micro-molding, the pin serving to align the first micro-molding, the mid-package film and the second micro-molding when they are bonded together.

6. The printhead assembly of claim 1 wherein the inlets of the second micro-molding are formed on an underside thereof.

7. The printhead assembly of claim 6 wherein six said inlets are provided for individual inks.

8. The printhead assembly of claim 6 wherein the second micro-molding also includes an air inlet.

9. The printhead assembly of claim 8 wherein the air inlet includes a slot extending across the second micro-molding.

10. The printhead assembly of claim 1 wherein the first micro-molding includes exit holes corresponding to inlets on a backing layer of the print chip.

11. The printhead assembly of claim 10 wherein the backing layer is made of silicon.

12. The printhead assembly of claim 1 further comprising an elastomeric pad on an edge of the second micro-molding.

13. The printhead assembly of claim 1 wherein the first and second micro-moldings are made of LCP.

14. The printhead assembly of claim 1 wherein a first surface of the first micro-molding has a series of alternating air inlets and outlets cooperative with a capping device to redirect a flow of air through the first micro-molding.

15. A printhead assembly incorporating a plurality of printheads as claimed in claim 1 , the printhead assembly including a channel along which the printheads are positioned.

16. The printhead assembly of claim 15 wherein the printhead modules have an elastomeric pad on an edge of their second micro-molding, the elastomeric pads bearing against an inner surface of the channel to positively locate the printhead modules within the channel.

Assignments (3)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028551/0325 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2004
From: SILVERBROOK, KIA
To: SILVERBROOK RESEARCH PTY. LTD.
Reel/Frame 016092/0528 →