Liquid cooling system and electronic equipment using the same
View Patent ↗For cooling of an electronic equipment, a heat receiving jacket, to which piping extended outside the electronic equipment is connected, is mounted to a heat generating element in the electronic equipment, a radiator, a cooling-liquid tank, a pump, and a pipe, which joins them, are constructed as an external module, and the external module is mounted externally and fixed to a housing of the electronic equipment. Cooling liquid is circulated by the pump through the heat receiving jacket, the radiator, and the tank to achieve cooling.
1. A liquid cooling system for cooling of a heat generating element included in an electronic equipment, comprising:
a heat receiving jacket, which is mounted to the heat generating element and to which piping extended outside the electronic equipment is connected; and
a cooling module mounted externally to a housing of the electronic equipment and comprising a radiator, a cooling-liquid tank, a pump, and piping joined to them for circulation therethrough of cooling liquid;
wherein the cooling-liquid tank is rotatably connected to the cooling module so as to be held in one of a horizontal position and a vertical position;
wherein the pump circulates the cooling liquid through the heat receiving jacket, the radiator, and the cooling-liquid tank to cause the radiator to cool that cooling liquid, which has absorbed heat in the heat receiving jacket and
wherein the cooling module is mounted externally to a back portion of the electronic equipment so as to be detachably mounted to the housing of the electronic equipment.
2. The liquid cooling system according to claim 1 , wherein a valved joint is provided on a portion of the piping, by which the heat receiving jacket is connected to the cooling module.
3. The liquid cooling system according to claim 1 , wherein the radiator is cooled by discharge air of a fan provided inside the electronic equipment, or a cooling fan of the cooling module.
4. The liquid cooling system according to claim 1 , wherein the heat generating element is a CPU.
5. A liquid cooling system for cooling of a heat generating element included in an electronic equipment, comprising:
a heat receiving jacket, which is mounted to the heat generating element and to which piping extended outside the electronic equipment is connected;
a cooling module mounted externally to a housing of the electronic equipment and comprising a radiator, a pump, and piping joined to them for circulation therethrough of cooling liquid; and
a cooling-liquid tank rotatably mounted externally to the cooling module in one of a horizontal and vertical position in accordance with a mounting configuration of the electronic equipment and joined to the cooling module through the piping;
wherein the pump circulates the cooling liquid through the heat receiving jacket, the radiator, and the cooling-liquid tank to cause the radiator to cool the cooling liquid, which has absorbed heat in the heat receiving jacket;
wherein the cooling module and the cooling-liquid tank are detachably mounted to the housing of the electronic equipment; and
wherein the cooling-liquid tank is detachably mounted to the cooling module.
6. The liquid cooling system according to claim 5 , wherein valved joints are provided on a portion of the piping, by which the heat receiving jacket is connected to the cooling module, and on a portion of the piping connected to the cooling-liquid tank, and
the cooling module and the cooling-liquid tank are detachably mounted externally to a back portion of the electronic equipment.
7. The liquid cooling system according to claim 5 , wherein the piping joined to the radiator and the pump for circulation therethrough of the cooling liquid comprises a metallic pipe.
8. The liquid cooling system according to claim 5 , wherein the cooling-liquid tank comprises a valved joint, by which it is rotatably connected to the cooling module.
9. The liquid cooling system according to claim 5 , wherein the heat generating element is a CPU.
10. An information processing apparatus with a heat generating element, comprising:
a heat receiving jacket, which is mounted to the heat generating element and to which piping extended outside the information processing apparatus is connected; and
a cooling module, which comprises a radiator, a cooling-liquid tank, and a pump, joined to them for circulation therethrough of a cooling liquid, and circulates the cooling liquid to cause the radiator to cool that cooling liquid, which has absorbed heat in the heat receiving jacket;
wherein the cooling-liquid tank is rotatably connected to the cooling module so as to be held in a horizontal position when the information processing apparatus is of a cabinet type and to be held in a vertical position when the information processing apparatus is of a rack mount type; and
wherein the cooling module is detachably mounted externally to a housing of the information processing apparatus.
11. The information processing apparatus according to claim 10 , wherein the cooling module is mounted externally to a back portion of the information processing apparatus.
12. The information processing apparatus according to claim 10 , wherein a valved joint is provided on a portion of the piping, by which the heat receiving jacket is connected to the cooling module, and
the cooling module is detachably mounted externally to a back portion of the information processing apparatus.
13. The information processing apparatus according to claim 10 , wherein the radiator is cooled by discharge air of a fan provided inside an electronic equipment, or a cooling fan of the cooling module.