Thermal transfer element
View Patent ↗A thermal transfer element is capable of improving transfer characteristics because transfer is performed at a low temperature. The thermal transfer element includes: a base substrate as a support substrate; a light-to-heat conversion layer formed on the base substrate to convert incident light to thermal energy; a transfer layer formed on the light-to-heat conversion layer to form an image; and a release layer formed between the base substrate and the light-to-heat conversion layer to facilitate delamination of the light-to-heat conversion layer from the base substrate. The release layer includes a silicon polymer having a glass transition temperature (Tg) of 25° C. or less, and low surface energy. In a further embodiment, the thermal transfer element includes an interlayer formed between the light-to-heat conversion layer and the transfer layer to protect the light-to-heat conversion layer.
1. A thermal transfer element, comprising:
a base substrate as a support substrate;
a light-to-heat conversion layer formed on the base substrate to convert incident light to thermal energy;
a transfer layer formed on the light-to-heat conversion layer to form an image; and
a release layer formed between the base substrate and the light-to-heat conversion layer to facilitate delamination of the light-to-heat conversion layer from the base substrate.
2. The thermal transfer element according to claim 1 , wherein the release layer comprises a material having a glass transition temperature Tg not greater than 25° C.
3. The thermal transfer element according to claim 2 , wherein the release layer comprises a silicon polymer having a low surface energy.
4. The thermal transfer element according to claim 3 , wherein the release layer is one of a coating layer and a deposition layer.
5. The thermal transfer element according to claim 4 , wherein the release layer is formed of a material curable by a method selected from ultraviolet curing, ambient temperature curing, low temperature curing, and catalyst curing.
6. The thermal transfer element according to claim 1 , wherein the release layer has a thickness not greater than 20 μm.
7. The thermal transfer element according to claim 6 , wherein the release layer has a thickness in a range of 1˜5 μm.
8. The thermal transfer element according to claim 1 , wherein the transfer layer comprises an image forming material for transferring an organic thin film layer having at least an emission layer.
9. The thermal transfer element according to claim 1 , wherein the transfer layer comprises an image forming material for transferring a plurality of organic thin film layers having at least an emission layer.
10. The thermal transfer element according to claim 9 , wherein at least one layer of the plurality of organic thin film layers is patterned.
11. A thermal transfer element, comprising:
a base substrate as a support substrate;
a light-to-heat conversion layer formed on the base substrate to convert incident light to thermal energy;
a transfer layer formed on the light-to-heat conversion layer to form an image;
an interlayer formed between the light-to-heat conversion layer and the transfer layer to protect the light-to-heat conversion layer; and
a release layer formed between the base substrate and the light-to-heat conversion layer to facilitate delamination of the light-to-heat conversion layer from the base substrate.
12. The thermal transfer element according to claim 11 , wherein the release layer comprises a material having a glass transition temperature Tg not greater than 25° C.
13. The thermal transfer element according to claim 12 , wherein the release layer comprises a silicon polymer having a low surface energy.
14. The thermal transfer element according to claim 13 , wherein the release layer is one of a coating layer and a deposition layer.
15. The thermal transfer element according to claim 14 , wherein the release layer is formed of a material curable by a method selected from ultraviolet curing, ambient temperature curing, low temperature curing, and catalyst curing.
16. The thermal transfer element according to claim 11 , wherein the release layer has a thickness not greater than 20 μm.
17. The thermal transfer element according to claim 16 , wherein the release layer has a thickness not greater than 5 μm.
18. The thermal transfer element according to claim 11 , wherein the transfer layer comprises an image forming material for transferring an organic thin film layer having at least an emission layer.
19. The thermal transfer element according to claim 11 , wherein the transfer layer comprises an image forming material for transferring a plurality of organic thin film layers having at least an emission layer, and wherein at least one layer of the plurality of organic thin film layers is patterned.