IP Library Granted Patent US 7,298,431
Granted Patent B2
US 7,298,431 · App. 11/015,019 · Granted Nov 20, 2007

Liquid crystal display device and fabricating method thereof

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,298,431
App. No.
11/015,019
Granted
Nov 20, 2007
Kind
B2
Abstract

A method for fabricating a liquid crystal display (LCD) device comprises forming an active pattern and a data line on a substrate, the active pattern including a source, a drain, and a channel regions; a first insulation film on a portion of the substrate; forming a gate electrode in a portion of the active pattern where the first insulation film is formed; a second insulation film on the substrate; forming a plurality of first contact holes exposing a portion of the source and drain regions and a second contact hole exposing a portion of the data line; forming a source electrode from a transparent conductive material connected to a source region within the respective first contact hole and a data line within the second contact hole; and forming a pixel and a drain electrodes from the transparent conductive material connected to a drain region within the respective first contact hole.

Claims (26)

1. A method for fabricating a liquid crystal display (LCD) device, comprising:

forming an active pattern and a data line on a substrate, the active pattern including a source region, a drain region, and a channel region;

disposing a first insulation film on a portion of the substrate;

forming a gate electrode in a portion of the active pattern where the first insulation film is formed;

disposing a second insulation film on the substrate;

forming a plurality of first contact holes to expose a portion of the source and drain regions and a second contact hole to expose a portion of the data line;

forming a source electrode from a transparent conductive material connected to a source region within one of the plurality of first contact holes and a data line within the second contact hole; and

forming a pixel electrode and a drain electrode from the transparent conductive material connected to a drain region within the other one of the plurality of first contact holes.

2. The method according to claim 1 , further comprising, forming a gate electrode, and thereafter forming a source region and a drain regions by injecting an impurity ion to a certain portions of the active pattern using the gate electrode as a mask.

3. The method according to claim 2 , wherein the impurity ion is a group V element.

4. The method according to claim 3 , wherein the group V element is phosphorus.

5. The method according to claim 2 , wherein the impurity ion is a group III element.

6. The method according to claim 5 , wherein the group III element is boron.

7. The method according to claim 1 , wherein a portion of the drain electrode is extended into a pixel region to form a pixel electrode.

8. The method according to claim 1 , wherein the step of forming the active pattern and the data line comprises:

disposing a silicon layer on the substrate;

disposing a conductive metal layer on the silicon layer;

forming a photosensitive pattern defined by a first portion having a first thickness, a second portion having a second thickness and a third portion by applying a diffraction mask to the photosensitive film;

etching the conductive metal layer exposed by the third portion and the silicon layer disposed directly underneath the exposed conductive metal layer;

removing a portion of the photosensitive film, thereby leaving only the photosensitive film pattern of the first portion; and

forming an active pattern and a data line by patterning the conductive metal layer using the photosensitive film pattern of the first portion as a mask.

9. The method according to claim 8 , wherein the silicon layer is formed of a crystallized silicon thin film.

10. The method according to claim 8 , wherein the first thickness is greater than the second thickness.

11. The method according to claim 8 , wherein the first portion is a data line region.

12. The method according to claim 8 , wherein the second portion is an active pattern region.

13. The method according to claim 8 , wherein the step of removing a portion of the photosensitive film includes ashing.