Repairable three-dimensional semiconductor subsystem
View Patent ↗A tightly packed three-dimensional electronic system or subsystem comprising multiple stacks of semiconductor elements is described. The system is repairable because the elements connect together using re-workable flip chip connectors; each flip chip connector comprises a conductive spring element on one side and a corresponding well filled with solder on the other side. The spring elements relieve stresses at the interfaces and allow the component stacks to remain flat; they also provide vertical compliance for easing assembly of elements that have been imperfectly thinned or planarized. Semiconductor integration platforms may be used to integrate active and passive devices, multi-layer interconnections, through wafer connections, I/O plugs, and terminals for attachment of other semiconductor elements or cables.
1. A connector for making a mechanically compliant flip chip connection between an input/output pad of an integrated circuit and a trace of an interconnection circuit comprising:
a metallic spring element integrally formed on said input/output pad;
a well having conductive walls connected to said trace of said interconnection circuit;
a conductive material substantially filling said well; and,
wherein the metallic spring element has a terminus that is inserted into said conductive material in said well to make said flip chip connection.
2. The flip chip connector of claim 1 wherein said conductive material is a conductive fluid or paste.
3. The flip chip connector of claim 1 wherein said conductive material is hardened after said insertion to bind the terminus of said spring structure in said conductive material in said well.
4. The flip chip connector of claim 1 wherein said conductive material is a solder having a paste form for said insertion and a solid form for said binding.
5. The flip chip connector of claim 2 wherein said conductive fluid or paste is a liquid metal.
6. A repairable electronic subsystem comprising:
a semiconductor integration platform having female terminals comprising wells filled with conductive material;
one or more semiconductor elements that attach to said integration platform, said semiconductor elements having a conductive spring element formed at each input/output pad and each spring element including a terminus; and,
wherein said attachment of said semiconductor elements to said integration platform is accomplished by inserting said terminus into said well filled with said conductive material.
7. The repairable electronic subsystem of claim 6 wherein said semiconductor elements attach to both sides of said integration platform, and said integration platform includes through wafer connections.
8. The repairable electronic subsystem of claim 6 having two or more of said integration platforms, wherein said integration platforms are electrically connected using input/output plugs implemented as specific forms of said semiconductor elements, said input/output plugs having through wafer connections spaced on a grid.
9. The repairable electronic subsystems of any one of claims 6 - 8 wherein said conductive material is a conductive fluid or paste.
10. The repairable electronic subsystems of any one of claims 6 - 8 wherein said conductive material is a solder.
11. The repairable electronic subsystem of claim 6 and including an interface adaptor that is thermally connected with said integration platform or one or more of said semiconductor elements, said interface adaptor including a planar base layer and flexible fingers extending from said base layer, and said thermal connection is achieved using said flexible fingers.
12. The repairable electronic subsystem of claim 6 and including a cable attached to said integration platform wherein said cable has integral spring elements formed at input/output pads, and each spring element has a terminus, and attachment is achieved by inserting each of said terminus into a corresponding one of said female terminals of said integration platform.
13. An integrated circuit assembly comprising:
a semiconductor substrate in which circuits are fabricated;
bump or wire-like terminals formed at input/output pads on a first side of said semiconductor substrate; and,
an interface adaptor including flexible fingers and a base layer supporting said fingers, wherein an end of each of said fingers attaches to a second side of said semiconductor substrate opposite the first side.
14. A semiconductor integration platform comprising:
a semiconductor substrate having conductive traces;
an assembly layer on one or both sides of said substrate;
at least one array of wells having conductive walls formed in said assembly layer, said array of wells adapted to accept a component to be attached;
electrical connection between said conductive walls and selected ones of said traces; and,
conductive material substantially filling said wells.
15. The semiconductor integration platform of claim 14 and further including through wafer connections in said semiconductor substrate.
16. The semiconductor integration platform of claim 14 and further including active and/or passive circuits fabricated in said semiconductor substrate.