IP Library Granted Patent US 7,183,759
Granted Patent B1
US 7,183,759 · App. 11/015,981 · Granted Feb 27, 2007

Optical probes with spacing sensors for the wafer level testing of optical and optoelectronic chips

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Quick Facts
Patent No.
US 7,183,759
App. No.
11/015,981
Granted
Feb 27, 2007
Kind
B1
Abstract

This application describes, among others, wafer designs, testing systems and techniques for wafer-level optical testing by coupling probe light to/from the top of the wafer. During the optical testing, the vertical spacing between an optical probe and the wafer is set to a very close distance, to achieve efficient optical coupling. It is beneficial to keep this close distance during optical testing as a constant in testing different optical components at different locations on the wafer. In one implementation, a spacing sensor may be used to measure the height of the optical probe from the wafer surface. This sensor may be a capacitance sensor that is mounted at the optical probe.

Claims (23)

1. An optical probe comprising a fiber array and a spacing sensor positioned above a plurality of optical structures disposed on an integrated substrate, wherein the spacing sensor measures a distance between the optical probe and the substrate, wherein the plurality of optical structures comprises an optical alignment loop disposed on the integrated substrate, wherein the fiber array of the optical probe is aligned with the alignment loop.

2. An optical probe according to claim 1 , wherein the spacing sensor comprises a capacitance sensor.

3. An optical probe according to claim 1 , wherein the optical probe comprises a light source and an optical detector.

4. An optical probe according to claim 1 , wherein the fiber array comprises a plurality of optical fibers, and at least one of the optical fibers is selected from a group comprising:

a single mode fiber,

a polarization maintaining fiber,

a multi-mode fiber and

a lensed fiber.

5. An optical probe according to claim 1 , and further comprising:

an optical probe positioner, where the optical probe positioner controls the position of the optical probe with respect to the integrated substrate,

a substrate positioner, where the substrate positioner controls the position of the substrate with respect to the optical probe,

and

a control system to control the optical probe positioner and the substrate positioner, where the control system is coupled to the spacing sensor and the control system controls the spacing between the optical probe and the integrated substrate.

6. An optical probe according to claim 5 , wherein the control system maintains a selected spacing between the optical probe and the substrate.

7. An optical probe according to claim 5 , wherein the control system performs a procedure to increase the spacing between the optical probe and the substrate, where the procedure to increase the spacing is performed prior to the lateral movement of the substrate with respect to the optical probe.

8. An optical probe according to claim 1 , wherein the integrated substrate is selected from a group comprising: a wafer, a die and an integrated circuit.

9. An optical probe according to claim 1 , wherein the optical loop comprises a plurality of optical input/output (I/O) couplers separated from each other to define a line parallel to an array of optical ports disposed on the integrated substrate, wherein each of the plurality of optical I/O couplers are optically aligned to a corresponding fiber in the fiber array of the optical probe.

10. An optical probe according to claim 9 , wherein the alignment loop further comprises a waveguide coupled to each of the plurality of optical I/O couplers, wherein one fiber of the fiber array sends a probe beam to the alignment loop and another fiber of the fiber array receives light output from the alignment loop.

11. An optical probe according to claim 1 , wherein the alignment loop comprises a plurality of optical ports within an array of ports disposed on the integrated substrate, wherein each of the plurality of optical ports are optically aligned to a corresponding fiber in the fiber array of the optical probe.

12. An optical probe according to claim 1 , wherein the alignment loop comprises a plurality of reflective or diffractive alignment structures disposed on the integrated substrate, wherein each of the plurality of alignment structures are optically aligned to a corresponding fiber in the fiber array of the optical probe.

13. An optical probe according to claim 1 , wherein the fiber array of the optical probe is aligned to the alignment loop in three dimensions, X, Y, and Z, wherein Z is the distance between the optical probe and the substrate.

14. An optical probe according to claim 13 , wherein the plurality of optical structures are passive, wherein the plurality of passive optical structures serve to measure a relative lateral (XY) position of the optical probe.

15. An optical probe according to claim 13 , wherein the spacing sensor measures a relative vertical (Z) position.

Assignments (7)
CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNOR'S NAME PREVIOUSLY RECORDED AT REEL: 058979 FRAME: 0027. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 24, 2022
From: LUXTERA LLC
To: CISCO TECHNOLOGY, INC.
Reel/Frame 059496/0803 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 8, 2022
From: CISCO SYSTEMS, INC.
To: CISCO TECHNOLOGY, INC.
Reel/Frame 058979/0027 →
RELEASE OF SECURITY INTEREST Recorded Dec 24, 2020
From: SILICON VALLEY BANK
To: LUXTERA, LLC
Reel/Frame 054855/0838 →
CHANGE OF NAME Recorded Feb 6, 2020
From: LUXTERA, INC.
To: LUXTERA LLC
Reel/Frame 052019/0811 →
SECURITY INTEREST Recorded Mar 29, 2017
From: LUXTERA, INC.
To: SILICON VALLEY BANK
Reel/Frame 042109/0140 →
SECURITY AGREEMENT Recorded Jun 17, 2009
From: LUXTERA, INC.
To: SILICON VALLEY BANK
Reel/Frame 022835/0340 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2004
From: MALENDEVICH, ROMAN; SUSSMAN, MYLES; GUNN III, LAWRENCE C.
To: LUXTERA, INC.
Reel/Frame 016121/0625 →