Chip-mounted film package
View Patent ↗A chip-mounted film package includes a base film, an effective film package defined on the base film by a cutting line, a driving chip mounted on the effective film package, a plurality of input pads arranged on an input area of the effective film package and connected to the driving chip, and a plurality of output pads arranged on an output area of the effective film package and connected to the driving chip, wherein the output area includes at least one extended portion that protrudes from a side of the effective film package in a horizontal direction of the base film.
1. A chip-mounted film package, comprising:
a base film including a cutting line;
an effective film package defined on the base film by the cutting line and including input area and output area;
a driving chip mounted on the effective film package;
a plurality of sprocket holes formed on the base film;
a plurality of input pads arranged on the input area of the effective film package and connected to the driving chip; and
a plurality of output pads arranged on the output area of the effective film package and connected to the driving chip,
wherein the output area includes at least one extended portion that protrudes from a side of the effective film package in a horizontal direction of the base film, and at least one of the sprocket holes is removed so as to leave a space for forming the extended portion.
2. The package according to claim 1 , wherein the base film includes a dummy area outside the cutting line, and the dummy area includes the plurality of sprocket holes to deliver the base film.
3. The package according to claim 2 , wherein the sprocket holes are arranged along a vertical direction of the base film.
4. The package according to claim 3 , wherein the at least one extended portion is positioned between the sprocket holes.
5. The package according to claim 1 , wherein the output area including the extended portion has a same width as that of the base film in the horizontal direction.