IP Library Granted Patent US 7,137,442
Granted Patent B2
US 7,137,442 · App. 11/016,938 · Granted Nov 21, 2006

Vapor chamber

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Quick Facts
Patent No.
US 7,137,442
App. No.
11/016,938
Granted
Nov 21, 2006
Kind
B2
Abstract

A vapor chamber, in which a condensable fluid, which evaporates and condenses depending on a state of input and radiation of a heat, is encapsulated in a hollow and flat sealed receptacle as a liquid phase working fluid; and in which the wick for creating the capillary pressure by moistening by the working fluid is arranged in said sealed receptacle, comprising: a wick for creating a great capillary pressure by being moistened by said working fluid, which is arranged on the evaporating part side where the heat is input from outside; and a wick having a small flow resistance against the moistening working fluid, which is arranged on the condensing part side where the heat is radiated to outside.

Claims (69)

1. A vapor chamber, comprising:

a hollow, scaled chamber comprising an evaporating part and a condensing part, wherein external heat enters the chamber through the evaporating part and internal heat is radiated to the external environment from the condensing part;

a fluid disposed within the chamber;

a first wick, disposed within the evaporating part, which is moistened by the fluid; and

a second wick, disposed within the condensing part;

wherein the second wick has a flow resistance against the fluid less than the flow resistance of the first wick against the fluid; and

wherein an end of the first wick is connected to an end of the second wick;

wherein the first wick is a porous sintered compound;

wherein the second wick is a coarse mesh; and

wherein at the connection between an end of the first wick and an end of the second wicks, portions of the porous sintered compound are layered with portions of the coarse mesh.

2. The vapor chamber according to claim 1 , wherein:

the chamber further comprises a heat insulating part, disposed between the evaporating part and the condensing part, in which there is no heat transfer between the inside of the chamber and the external environment; and

the second wick is disposed within the condensing part and the heat insulating part.

3. The vapor chamber according to claim 1 , wherein:

the porous sintered compound comprises sintered copper particles, each having a diameter between 25 to 100 μm; and

the coarse mesh is 100 mesh.

4. The vapor chamber according to claim 1 , wherein:

the first wick is a first porous sintered compound comprising sintered particles; and

the second wick is a second porous sintered compound comprising sintered particles of a larger diameter thin the particles comprising the first porous sintered compound.

5. The vapor chamber according to claim 1 , wherein:

the first wick is a porous sintered compound; and

the second wick is a plurality of thin slits.

6. The vapor chamber according to claim 1 , wherein:

the first wick is a mesh; and

the second wick is a porous sintered compound.

7. The vapor chamber according to claim 5 , wherein:

the first wick is a 200 mesh.

8. The vapor chamber according to claim 1 , wherein:

the first wick is a first mesh; and

the second wick is a second mesh coarser than the first mesh.

9. The vapor chamber according to claim 8 , wherein:

the first mesh is a 200 mesh; and

the second mesh is a 100 mesh.

10. The vapor chamber according to claim 1 , wherein:

the first wick is a mesh; and

the second wick is a plurality of thin slits.

11. The vapor chamber according to claim 10 , wherein:

the first Wick is a 200 mesh.

12. A vapor chamber, comprising:

a hollow, scaled chamber comprising an evaporating part and a condensing part, wherein external heat enters the chamber through the evaporating part and internal heat is radiated to the external environment from the condensing part;

a fluid disposed within the chamber;

a first wick, disposed within the evaporating part, which is moistened by the fluid; and

a second wick, disposed within the condensing part;

wherein the second wick has a flow resistance against the fluid less than the flow resistance of the first wick against the fluid;

wherein an end of the first wick is connected to an end of the second wick;

wherein the first wick is a first porous sintered compound comprising sintered particles; and

wherein the second wick is a second porous sintered compound comprising sintered particles of a larger diameter than the particles comprising the first porous sintered compound.

13. The vapor chamber according to claim 12 , wherein:

the chamber further comprises a heat insulating part, disposed between the evaporating part and the condensing part, in which there is no heat transfer between the inside of the chamber and the external environment; and

the second wick is disposed within the condensing part and the heat insulating part.

14. The vapor chamber according to claim 12 , wherein:

the first wick is a porous sintered compound; and

the second wick is a plurality of thin slits.

15. The vapor chamber according to claim 14 , wherein:

the first wick is a mesh; and

the second wick is a porous sintered material.

16. The vapor chamber according to claim 14 , wherein:

the first wick is 200 mesh.

17. The vapor chamber according to claim 12 , wherein:

the first wick is a first mesh; and

the second wick is a second mesh coarser than the first mesh.

18. The vapor chamber according to claim 17 , wherein:

the first mesh is a 200 mesh; and

the second mesh is a 100 mesh.

19. The vapor chamber according to claim 12 , wherein:

the first wick A is a mesh; and

the second wick is a plurality of thin slits.

20. The vapor chamber according to claim 19 , wherein:

the first wick is a 200 mesh.

Assignments (2)
NUNC PRO TUNC ASSIGNMENT Recorded Nov 25, 2015
From: LENOVO (SINGAPORE) PTE LTD.
To: LENOVO PC INTERNATIONAL
Reel/Frame 037160/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 29, 2005
From: KAWAHARA, YOUJI; TAKADA, NORIYUKI; MOCHIZUKI, MASATAKA; MASHIKO, KOICHI; SAITO, YUJI; KOBAYASHI, TETSUYA; TAKAMIYA, AKIHIRO; SANO, TADASHI; KIYOOKA, FUMITOSHI; AGATA, HIROAKI
To: FUJIKURA LTD.; INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 016409/0759 →