Channel-etch thin film transistor

1. A channel-etch thin film transistor comprising:

a gate electrode over a substrate;

a gate insulation film extending over said gate electrode and said substrate;

an active layer including a channel region over said gate insulation film;

a source region and a drain region on said active layer;

a source electrode connected with said source region, and said source electrode including a source electrode primary portion in contact with said source region and a source electrode lead portion extending from said source electrode primary portion; and

a drain electrode connected with said drain region, and said drain electrode including a drain electrode primary portion in contact with said drain region and a drain electrode lead portion extending from said drain electrode primary portion,

wherein at least one of said source electrode and said drain electrode is separated from a side wall of said active layer by an inter-layer insulator, said at least one of said source electrode and said drain electrode including a first lead part extending over said inter-layer insulator and a second lead part extending under said inter-layer insulator and over said gate insulation film, wherein said second lead part is in contact with said gate insulation film.

2. The channel-etch thin film transistor as claimed in claim 1 , wherein at least one of said source electrode primary portion and said drain electrode primary portion has a wide region which has the same width as respective end portion of said at least one of said source electrode primary portion and said drain electrode primary portion and a length of at least 3 micrometers along a channel length direction.

3. The channel-etch thin film transistor as claimed in claim 1 , wherein a peripheral edge of said gate electrode is positioned outside of a peripheral edge of said active layer in plan view.

4. The channel-etch thin film transistor as claimed in claim 1 , wherein said substrate comprises a glass substrate of a liquid crystal display, and said source electrode is connected to a pixel electrode, and said drain electrode is connected to a data line.

5. The channel-etch thin film transistor as claimed in claim 1 , wherein both of said source electrode and said drain electrode are separated from side walls of said active layer by an inter-layer insulator.

6. The channel-etch thin film transistor as claimed in claim 5 , wherein said source electrode lead portion comprises:

a first source lead part extending over said inter-layer insulator and being connected through a first via hole to said source electrode primary portion; and

a second source lead part extending under said inter-layer insulator and over said gate insulation film and being connected through a second via hole to said first source lead part and also being connected through a third via hole to a pixel electrode, and

wherein said drain electrode lead portion comprises:

a first drain lead part extending over said inter-layer insulator and being connected through a fourth via hole to said drain electrode primary portion; and

a second drain lead part extending under said inter-layer insulator and over said gate insulation film and being connected through a fifth via hole to said first drain lead part and also being connected to a data line.

7. The channel-etch thin film transistor as claimed in claim 6 , wherein each of said first source lead part and said first drain lead part comprises a transparent and electrically connective material.

8. The channel-etch thin film transistor as claimed in claim 7 , wherein each of said source electrode primary portion and said drain electrode primary portion comprises a metal.

9. The channel-etch thin film transistor as claimed in claim 5 , wherein said source electrode lead portion comprises:

a first via contact which connects said source electrode primary portion to a pixel electrode extending over said inter-layer insulator, and

wherein said drain electrode lead portion comprises:

a first drain lead part extending over said inter-layer insulator and being connected through a fourth via hole to said drain electrode primary portion; and

a second drain lead part extending under said inter-layer insulator and over said gate insulation film and being connected through a fifth via hole to said first drain lead part and also being connected to a data line.

10. The channel-etch thin film transistor as claimed in claim 9 , wherein said first drain lead part comprises a transparent and electrically connective material.

11. The channel-etch thin film transistor as claimed in claim 10 , wherein each of said source electrode primary portion and said drain electrode primary portion comprises a metal.

12. The channel-etch thin film transistor as claimed in claim 1 , wherein one of said source electrode and said drain electrode is separated from side walls of said active layer by an inter-layer insulator.

13. The channel-etch thin film transistor as claimed in claim 12 , wherein said drain electrode is separated from side walls of said active layer by the inter-layer insulator and said source electrode lead portion has a side-contact portion in contact directly with a side wall of said active layer, and

wherein said drain electrode lead portion comprises:

a first drain lead part extending over said inter-layer insulator and being connected through a fourth via hole to said drain electrode primary portion; and

a second drain lead part extending under said inter-layer insulator and over said gate insulation film and being connected through a fifth via hole to said first drain lead part and also being connected to a data line.

14. The channel-etch thin film transistor as claimed in claim 13 , wherein said source electrode primary portion is narrower than said drain electrode primary portion, and said side-contact portion of said source electrode has a width narrower than or equal to said source electrode primary portion.

15. The channel-etch thin film transistor as claimed in claim 13 , wherein said first drain lead part comprises a transparent and electrically connective material.

16. The channel-etch thin film transistor as claimed in claim 15 , wherein each of said source electrode primary portion and said drain electrode primary portion comprises a metal.