IP Library Granted Patent US 7,425,757
Granted Patent B2
US 7,425,757 · App. 11/017,187 · Granted Sep 16, 2008

Semiconductor power module

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Quick Facts
Patent No.
US 7,425,757
App. No.
11/017,187
Granted
Sep 16, 2008
Kind
B2
Abstract

A semiconductor power module includes a filter element made of a magnetic material that can be exchanged as required, while providing a package having a compact size. The power module can be used for a power conversion device for providing power conversion of DC power or AC power by switching a power semiconductor element, such as an IGBT. The filter element can be an annular magnetic member that rests around one or more terminals connected to the power semiconductor element. Noise current flowing through the terminals, when the power semiconductor element is switched, can be suppressed effectively with the annular magnetic member.

Claims (36)

1. A semiconductor power module comprising:

a module package;

at least one power semiconductor element contained in the module package and at least one terminal connected to the power semiconductor element and provided at the exterior of the module package; and

a replaceable filter member made of magnetic material for reducing noise current flowing through the terminal and positioned to surround the terminal,

wherein the replaceable filter member is exposed so as to be replaceable from the module package and is substantially annular in shape to surround the terminal.

2. A semiconductor power module according to claim 1 , further including a driving circuit for the power semiconductor element contained in the module package.

3. A semiconductor power module comprising:

a module package;

at least one power semiconductor element contained in the module package and at least one terminal connected to the power semiconductor element and provided at the exterior of the module package; and

a replaceable filter member made of magnetic material for reducing noise current flowing through the terminal and positioned to surround the terminal,

wherein the replaceable filter member is exposed so as to be replaceable from the module package, and

wherein the module package includes a recessed portion formed around the terminal to provide a space for resting the replaceable filter member.

4. A semiconductor power module according to claim 2 , wherein the module package includes a recessed portion formed around the terminal to provide a space for resting the replaceable filter member.

5. A semiconductor power module comprising:

a module package;

at least one power semiconductor element contained in the module package and at least one terminal connected to the power semiconductor element and provided at the exterior of the module package; and

a replaceable filter member made of magnetic material for reducing noise current flowing through the terminal and positioned to surround the terminal,

wherein the replaceable filter member is exposed so as to be replaceable from the module package, and

wherein an area around the terminal projects beyond a main surface of the module package to provide a space for resting the replaceable filter member.

6. A semiconductor power module according to claim 2 , wherein an area around the terminal projects beyond a main surface of the module package to provide a space for resting the replaceable filter member.

7. A semiconductor power module according to claim 1 , wherein the terminal is for transmitting AC or DC power or transmitting a control signal to the power semiconductor element.

8. A semiconductor power module according to claim 2 , wherein the terminal is for transmitting AC or DC power or transmitting a control signal to the power semiconductor element.

9. A semiconductor power module according to claim 3 , wherein the terminal is for transmitting AC or DC power or transmitting a control signal to the power semiconductor element.

10. A semiconductor power module according to claim 4 , wherein the terminal is for transmitting AC or DC power or transmitting a control signal to the power semiconductor element.

11. A semiconductor power module according to claim 5 , wherein the terminal is for transmitting AC or DC power or transmitting a control signal to the power semiconductor element.

12. A semiconductor power module according to claim 6 , wherein the terminal is for transmitting AC or DC power or transmitting a control signal to the power semiconductor element.

13. A semiconductor power module according to claim 1 , wherein the replaceable filter member surrounds one terminal.

14. A semiconductor power module according to claim 1 , wherein a plurality of terminals connect to the at least one power semiconductor element contained in the module package and the terminals are provided at the exterior of the module package.

15. A semiconductor power module according to claim 14 , wherein the replaceable filter member surrounds at least two of the terminals.

16. A semiconductor power module comprising:

a module package;

at least one power semiconductor element contained in the module package and at least one terminal connected to the power semiconductor element and provided at the exterior of the module package; and

a replaceable filter member made of magnetic material for reducing noise current flowing through the terminal and positioned to surround the terminal,

wherein the replaceable filter member is exposed so as to be replaceable from the module package, and

wherein a plurality of terminals connect to the at least one power semiconductor element contained in the module package and provided at the exterior of the module package,

wherein the replaceable filter member is figure-8 shaped to surround at least two terminals.

Assignments (3)
MERGER AND CHANGE OF NAME Recorded Aug 26, 2011
From: FUJI ELECTRIC SYSTEMS CO., LTD. (FES); FUJI TECHNOSURVEY CO., LTD. (MERGER BY ABSORPTION)
To: FUJI ELECTRIC CO., LTD.
Reel/Frame 026970/0872 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 20, 2010
From: FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD.
To: FUJI ELECTRIC SYSTEMS CO., LTD.
Reel/Frame 024252/0438 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 28, 2005
From: TAKUBO, HIROMU
To: FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD.
Reel/Frame 016398/0966 →