Method of fabricating a semiconductor integrated circuit that includes patterning a semiconductor substrate with a first photomask that uses metal for blocking light and patterning the same substrate with a second photomask that uses organic resin for blocking light

1. A method of fabricating a semiconductor integrated circuit device, in which various products are manufactured, the method comprising:

a first step of using-a first photomask having a metal film as an opaque film for an exposure light in order to form a structural pattern common to said various products, and exposing said common structural pattern onto a first photoreactive film formed over a semiconductor substrate; and

a second step of using a second photomask having an organic photoreactive resin film as an opaque film for the exposure light in order to form a pattern different per product class of said various products, and exposing said pattern different per product class onto a second photoreactive film formed over said semiconductor substrate.

2. The method of fabricating a semiconductor integrated circuit device according to claim 1 ,

wherein an annular illumination is used in the exposure using said first photomask.

3. The method of fabricating a semiconductor integrated circuit device according to claim 1 ,

wherein the opaque film of said second photomask is a lamination film of an anti-reflective film and an organic photoreactive resin film.

4. A method of fabricating a semiconductor integrated circuit device, the method having in common a step of manufacturing a transistor over a semiconductor substrate, wherein various products are classified into a plurality of kinds during a wiring process, the method comprising the steps of:

using a first photomask having a metal film as an opaque film for an exposure light in order to form a structural pattern common to said various products, and exposing a first photoreactive film formed over said semiconductor substrate: and

using a second photomask for a hole or a wiring pattern, which has an organic photoreactive resin film as an opaque film for the exposure light in order to form a pattern different per product class of said various products, and exposing a second photoreactive film formed over said semiconductor substrate.

5. The method of fabricating a semiconductor integrated circuit device according to claim 4 ,

wherein patterns for diffused layer are formed in said first photomask.

6. The method of fabricating a semiconductor integrated circuit device according to claim 5 ,

wherein said organic photoreactive resin film is made of a resist material for electron beam.

7. The method of fabricating a semiconductor integrated circuit device according to claim 4 ,

wherein patterns for device isolation are formed in said first photomask.

8. The method of fabricating a semiconductor integrated circuit device according to claim 7 ,

wherein said organic photoreactive resin film is made of a resist material for electron beam.

9. The method of fabricating a semiconductor integrated circuit device according to claim 4 ,

wherein said organic photoreactive resin film is made of a resist material for electron beam.

10. The method of fabricating a semiconductor integrated circuit device according to claim 4 ,

wherein the opaque film of said second photomask is a lamination film of an anti-reflective film and an organic photoreactive resin film.

11. A method of fabricating a semiconductor integrated circuit device, the method having in common a step of manufacturing a transistor over a semiconductor substrate, wherein various products are classified into a plurality of kinds during a wiring process, the method comprising the steps of:

using a first photomask having a metal film as an opaque film; and forming over a surface of said semiconductor substrate a diffused layer pattern of a transistor with a structure common to said various products; and

using a second photomask having an organic photoreactive resin film as an opaque film for an exposure light, and forming over the surface of said semiconductor substrate a wiring pattern different per product class of said various products.

12. A method of fabricating a mask ROM having a plurality of field effect transistors as a memory cell, the method comprising the steps of:

using a first photomask having a metal film as an opaque film for an exposure light, and forming a first resist pattern for forming a diffused layer of each of said field effect transistors;

forming a gate electrode for each of said field effect transistors;

using a second photomask having an organic photoreactive resin layer as an opaque film for the exposure light, and forming a second resist pattern having a predetermined opening; and

introducing an impurity into a channel region of each of said field effect transistors through said opening to write data.

13. The method of fabricating a mask ROM according to claim 12 , wherein said second photomask includes a metal film as an opaque film for the exposure light.

14. A method of fabricating a mask ROM having a plurality of field effect transistors as a memory cell; the method comprising the steps of:

using a first photomask having a metal film as an opaque film for an exposure light, and forming a first resist pattern for forming a diffused layer of each of said field effect transistors;

forming a gate electrode for each of said field effect transistors; and

using a second photomask having an organic photoreactive resin layer as an opaque film for the exposure light, and forming a second resist pattern to be a contact hole for said gate electrode and said diffused layer.

15. A method of fabricating a semiconductor integrated circuit device, in which various products are manufactured and which includes a step of selecting one of a first photomask having a metal film as an opaque film for an exposure light and a second photomask having an organic photoreactive resin film as an opaque film for the exposure light; the method comprising the steps of:

projecting and exposing a pattern formed over said first or second photomask selected, onto a photoreactive layer formed over a semiconductor substrate, and forming a bonding pad thereafter;

forming a polyimide resin film over said semiconductor substrate having said bonding pad;

forming over said polyimide resin film a relocation wiring layer different per product class of said various products;

forming a solder bump electrically connected to said relocation wiring layer; and

thereafter dividing said semiconductor substrate into a semiconductor chip,

wherein a pattern of said relocation wiring is formed using said second photomask having said organic photoreactive resin film as an opaque film.