IP Library Granted Patent US 7,822,346
Granted Patent B2
US 7,822,346 · App. 11/024,204 · Granted Oct 26, 2010

Module housing for connecting opto-electronic sub-assemblies

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Quick Facts
Patent No.
US 7,822,346
App. No.
11/024,204
Granted
Oct 26, 2010
Kind
B2
Abstract

This disclosure generally concerns modules. In one example, a module includes a housing, a printed circuit board, and an optical subassembly. The housing has a first part and a second part, with the second part holding the printed circuit board and optical subassembly. The printed circuit board has a contact element located near one end of the printed circuit board. The optical subassembly includes a connector which has a free end. The free end of the connector and the contact element of the printed circuit board are pinched together when the first and second parts of the housing are joined, thus forming an electrical connection.

Claims (25)

1. An optoelectronic device, comprising:

a TOSA, wherein the TOSA is configured to transmit optical signals and wherein the TOSA includes:

a notch on the exterior of the TOSA; and

a first electrical connector which has a free end;

a ROSA, wherein the ROSA is configured to receive optical signals and wherein the ROSA includes:

a notch on the exterior of the ROSA; and

a second electrical connector which has a free end;

a printed circuit board, wherein the printed circuit board includes:

circuitry configured to control the operation of the TOSA and the ROSA; and

a contact element located on the printed circuit board, wherein:

the contact element is in electrical communication with the circuitry of the printed circuit board;

the contact element is located proximate the free end of the first electrical connector and free end of the second electrical connector; and

the contact element is configured to electrically communicate with the free end of the first electrical connector and the free end of the second electrical connector; and

a housing configured to substantially enclose the TOSA, the ROSA and the printed circuit board, wherein the housing includes:

a first part; and

a second part, wherein the second part is configured to join with the first part and substantially enclose the TOSA, the ROSA and the printed circuit board; and

wherein the first part cooperates with the second part to pinch the free end of the first electrical connector together with the contact element and to pinch the free end of the second electrical connector together with the contact element when the first part of the housing is joined with the second part of the housing;

wherein the first part and the second part of the housing are not electrically connected with the free end of the first electrical connector, the free end of the second electrical connector or the contact element of the printed circuit board;

wherein the first part cooperates with the second part, the notch of the TOSA and the notch of the ROSA to mechanically align the TOSA and ROSA within the housing; and

wherein the first part and the second part allow movement between the first free end and the contact element and movement between the second free end and the contact element to accommodate for at least one of thermal conditions, misalignment, and flex while maintaining the first free end and the second free end in contact with the contact element.

2. The optoelectronic device of claim 1 , wherein the first electrical connector comprises a flex circuit.

3. The optoelectronic device of claim 1 , wherein the first electrical connector comprises an array of pins.

4. The optoelectronic device of claim 1 , wherein the first part of the housing includes an arm configured and arranged to pinch the free end of the first electrical connector together with the contact element when the first part of the housing and the second part of the housing are joined together.

5. The optoelectronic device of claim 4 , wherein the arm has an electrically non-conductive tip arranged for contact with the free end of the first electrical connector.

6. The optoelectronic device of claim 1 , wherein the housing includes a locating and retaining structure to position the printed circuit board and the first electrical connector such that a passive electrical connection is made before the first part of the housing and the second part of the housing are joined.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 28, 2004
From: ROSENBERG, PAUL
To: FINISAR CORPORATION
Reel/Frame 016140/0226 →