Pressure transducer
View Patent ↗One aspect is a pressure transducer package comprising a housing, a diaphragm, a support disposed in the housing and a sensing element disposed in the housing between the diaphragm and the support so that the pressure from the environment acts on the diaphragm to compress the sensing element. The sensing element comprises at least one substrate having a coefficient of thermal expansion greater than 4 ppm/k. In another aspect, the sensing element comprises at least one substrate formed of a first material and an epitaxial layer of a second material having a lower coefficient of thermal expansion. In a further aspect, the support abuts the housing at a spherically-shaped interface to compensate for misalignment between the support and the sensing element to ensure that the sensing element is evenly loaded.
1. A pressure transducer package for measuring the pressure in an environment, the pressure transducer package comprising:
a housing;
a diaphragm supported by the housing;
a support disposed in the housing; and
a sensing element disposed in the housing between the diaphragm and the support so that the pressure from the environment acts on the diaphragm to compress the sensing element, the sensing element comprising;
at least one substrate; and
at least one piezoresistor formed on the at least one substrate;
wherein the at least one substrate is formed of a material having a coefficient of thermal expansion greater than 4 ppm/k at 600 degrees kelvin.
2. The pressure transducer package of claim 1 , wherein the substrate material has a coefficient of thermal expansion greater than 4.5 ppm/k at 600 degrees kelvin.
3. The pressure transducer package of claim 1 , wherein the substrate material has a coefficient of thermal expansion greater than 5 ppm/k at 600 degrees kelvin.
4. The pressure transducer package of claim 1 , wherein the substrate material has a coefficient of thermal expansion greater than 5.5 ppm/k at 600 degrees kelvin.
5. The pressure transducer package of claim 1 , wherein the substrate material has a coefficient of thermal expansion greater than 6 ppm/k at 600 degrees kelvin.
6. The pressure transducer package of claim 1 , wherein the substrate material has a coefficient of thermal expansion greater than 6.5 ppm/k at 600 degrees kelvin.
7. The pressure transducer package of claim 1 , wherein the substrate material has a coefficient of thermal expansion greater than 7 ppm/k at 600 degrees kelvin.
8. The pressure transducer package of claim 1 , wherein the substrate material is sapphire.
9. The pressure transducer package of claim 1 , wherein the at least one substrate comprises first and second substrates, and wherein the first and second substrates each is supported by a filler disposed between the first and second substrates.
10. The pressure transducer package of claim 9 , wherein the filler is formed of a material that is less expensive than the substrate material.
11. The pressure transducer package of claim 9 , wherein the substrate material is sapphire for each of the first and second substrates, and wherein the filler is alumina.
12. The pressure transducer package of claim 1 , wherein the support is separate from and not integral with the housing.
13. The pressure transducer package of claim 1 , wherein the support is integral with the housing.
14. The pressure transducer package of claim 1 , further comprising a compensator disposed between the diaphragm and the sensing element.
15. The pressure transducer package of claim 14 , wherein the compensator is formed of a material having a coefficient of thermal expansion greater than that of the substrate.
16. The pressure transducer package of claim 14 , wherein the compensator is formed of a material having a coefficient of thermal expansion greater than that of the housing.