Electronic device and method for producing the same
View Patent ↗An electronic device includes a plurality of components, nanoparticles to bond the components, and a receiving layer for holding the nanoparticles, the receiving layer being disposed on at least one of the bonded components. The electronic device may further include an electrode disposed on at least one of the plurality of components. The receiving layer is disposed on the surface of the electrode. Conductive particles etc. are mixed in the receiving layer.
1. An electronic device comprising:
two components;
a receiving layer on at least one of the two components, the receiving layer including at least one of conductive particles and conductive fibers; and
metallic nanoparticles on the receiving layer and bonding the two components together;
wherein at least some of the nanoparticles are bonded together and closely contacted with the receiving layer by fusing.
2. The electronic device according to claim 1 , wherein the receiving layer includes any one of polyamic acids, acrylic resins, alumina hydrate, calcium carbonate, magnesium carbonate, synthetic silica fine particles, talc, caolin, calcium sulfate, and barium sulfate.
3. The electronic device according to claim 1 , wherein an electrode is disposed on at least one of the two components and the receiving layer is disposed on a surface of the electrode.
4. The electronic device according to claim 3 , wherein the surface of the electrode is chemically or physically modified in wettability.
5. The electronic device according to claim 1 , wherein the metallic nanoparticles are formed of at least one of gold, silver, and copper.
6. An electronic device comprising:
two components;
a receiving layer on at least one of the two components, the receiving layer being composed of conductive carbon nanotubes; and
metallic nanoparticles on the receiving layer and bonding the two components together;
wherein at least some of the nanoparticles are bonded together and closely contacted with the receiving layer by fusing.
7. The electronic device according to claim 6 , wherein an electrode is disposed on at least one of the two components and the receiving layer is disposed on a surface of the electrode.
8. The electronic device according to claim 7 , wherein the surface of the electrode is chemically or physically modified in wettability.
9. The electronic device according to claim 6 , wherein the metallic nanoparticles are formed of at least one of gold, silver, and copper.