Method of fabricating monolithic microelectromechanical fluid ejection device
View Patent ↗A method for forming a printhead having a very high dot-per-inch printing capability is described. The method includes forming a layer containing electronic control circuits upon a semiconductor wafer. Nozzle chambers are then etched into the wafer and corresponding fluid ejection assemblies are formed for each nozzle chamber. Ink inlets for the nozzle chambers are produced by back-etching through the wafer. Steps for fabricating thermal bend actuators to eject ink from the nozzles are also described.
1. A method for fabricating a monolithic microelectromechanical fluid ejection device comprising a plurality of fluid ejection nozzles upon a semiconductor wafer, the method including:
forming a layer containing electronic control circuits upon the wafer;
etching nozzle chambers into the wafer to contain fluid;
forming fluid ejection assemblies for each nozzle chamber including depositing a first layer of heater material, depositing a layer of glass over the first layer of heater material, and depositing a second layer of heater material over the layer of glass; and
back-etching through the wafer to define ink inlets in communication with the nozzle chambers.
2. A method according to claim 1 , wherein the step of forming fluid ejection assemblies includes depositing heater material on the wafer to heat an activating arm of the fluid ejection assemblies in their complete state.
3. A method according to claim 1 , wherein the step of depositing the first layer of heater material comprises depositing a cupronickel layer.
4. A method according to claim 3 , wherein the step of depositing the cupronickel layer includes:
depositing a layer of anti-corrosion material;
depositing a seed layer; and
electroplating the cupronickel layer.
5. A method according to claim 1 , including etching the first and second layers of heater material and the layer of glass with a mask defining actuators and paddles of the fluid ejection assemblies.
6. A method according to claim 5 , including forming nozzle chamber walls by depositing sacrificial material onto the wafer and etching the sacrificial material with a mask defining the nozzle chamber walls.
7. A method according to claim 1 , including hydrophobizing a fluid ejection surface of the fluid ejection device.
8. A method according to claim 1 , wherein the layer containing electronic control circuits comprises a CMOS layer.