Printhead and ink supply arrangement
View Patent ↗Microelectromechanical printheads are formed on a silicon wafer using etching technology similar that used in standard integrated circuit fabrication processes. The printheads include a very large number of micron-order ink inlet channels. A difficulty arises in accurately providing such a printhead with a reliable ink supply. The present invention addresses the above problem by providing an ink supply molding that includes a slot to receive the printhead. A plurality of ink supply passageways are formed in the ink supply molding of approximately 100 micron width. The ink supply molding is received into a baffle molding that includes ink conduits which in turn communicate with the ink supply passageway. In one embodiment a web of ink filtering material is disposed between the ink supply molding and the baffle molding.
1. A printhead and ink supply arrangement including:
a microelectromechanical page width printhead;
an ink supply molding including a slot into which said printhead is received, said molding defining a plurality of ink supply passageways in communication with ink inlets formed on the printhead; and
a baffle molding located about the ink supply molding and including ink conduits in communication with the ink supply passageways.
2. A printhead and ink supply molding according to claim 1 , wherein a filter is located between the ink supply molding and the baffle molding.
3. An arrangement according to claim 1 , wherein the ink supply passageways have a width in the range of 50 microns to 150 microns.
4. An arrangement according to claim 1 , wherein said printhead is fastened within the slot by an adhesive.
5. An arrangement according to claim 1 , wherein the baffle molding includes a series of pierceable end wall portions.
6. An arrangement according to claim 1 , including an assembly to regulate the ingress of air into the baffle molding.
7. An arrangement according to claim 6 , wherein the assembly to regulate the ingress of air into the baffle molding comprises a series of hydrophically sealed holes formed into a housing in which the baffle molding is located.
8. An arrangement according to claim 7 , wherein the film is positioned over the housing by protuberances formed upon the housing to engage corresponding apertures formed in the film.
9. An arrangement according to claim 6 , including a film bearing conductive traces located to supply electrical signals to said print head.
10. An arrangement according to claim 1 , wherein the baffle molding includes a series of baffles arranged to slow the flow of ink along the ink conduits in response to movement of the arrangement.
11. A printhead and ink supply arrangement including:
a microelectromechanical pagewidth printhead;
an ink supply molding including a slot into which said printhead is received, the molding defining a plurality of ink supply passageways in communication with ink inlets formed on the printhead;
a baffle molding located about the ink supply molding and including
ink conduits in communication with the ink supply passageways, and
a series of baffles arranged to slow the flow of ink along the ink conduits in response to movement of the arrangement;
a film bearing conduction paths to supply electrical signals to the printhead; and
a housing located about the baffle molding including protuberances engaging corresponding apertures formed in the film in order to accurately locate the conduction paths relative to the printhead.