IP Library Granted Patent US 7,184,455
Granted Patent B2
US 7,184,455 · App. 11/026,385 · Granted Feb 27, 2007

Mirrors for reducing the effects of spontaneous emissions in photodiodes

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Quick Facts
Patent No.
US 7,184,455
App. No.
11/026,385
Granted
Feb 27, 2007
Kind
B2
Abstract

An optical structure that reduces the effects of spontaneous emissions from the active region of a laser. An optical structure includes optimizations to reduce the effects of spontaneous emissions. The optical structure includes a VCSEL with top and bottom DBR mirrors and an active region connected to the mirrors. The optical structure further includes a photodiode connected to the VCSEL. One or more optimizations may be included in the optical structure including optically absorbing materials, varying the geometry of the structure to change reflective angles, using optical apertures, changing the reflectivity of one or more mirrors, changing the photodiode to be more impervious to spontaneous emissions, and using ion implants to reduce photoluminescence efficiency.

Claims (39)

1. An optical structure comprising:

a VCSEL, the VCSEL comprising:

a top DBR mirror;

an active region coupled to the top DBR mirror; and

a bottom DBR mirror coupled to the active region;

a photodiode coupled to the VCSEL;

a substrate;

a DBR mirror interposed between the photodiode and the substrate, the DBR mirror configured to reflect laser emissions from the VCSEL back through the photodiode; and

an optical aperture disposed between the VCSEL and the photodiode oriented to block at least a portion of off-axis spontaneous emissions.

2. The optical structure of claim 1 , wherein the VCSEL comprises a mesa structure, wherein the mesa structure comprises irregularities on walls of the mesa structure.

3. The optical structure of claim 1 , further comprising an absorbing material disposed in the optical structure, the absorbing material comprising a composition configured to absorb optical emissions.

4. The optical structure of claim 1 , wherein at least one of the top DBR mirror and the bottom DBR mirror is optimized to decrease the critical angle caused by an interface between the DBR mirror and the active region.

5. The optical structure of claim 1 , wherein at least one of the top DBR mirror and the bottom DBR mirror is optimized to reduce transmission of off axis emissions at a specific angle.

6. The optical structure of claim 1 , wherein the photodiode comprises an increased bandgap to reduce responsivity of the photodiode above a predetermined laser emission wavelength.

7. The optical structure of claim 1 , further comprising a wide bandgap layer coupled to the photodiode on a side of the photodiode opposite the VCSEL.

8. A method of manufacturing an optical structure comprising:

forming a VCSEL above a substrate, forming the VCSEL comprising:

forming a top DBR mirror

forming an active region coupled to the top DBR mirror; and

forming a bottom DBR mirror coupled to the active region;

forming a photodiode coupled to the VCSEL;

forming a DBR mirror such that the DBR mirror is interposed between the photodiode and the substrate, the DBR mirror configured to reflect laser emissions from the VCSEL back through the photodiode; and

optimizing at least one of the top DBR mirror and the bottom DBR mirror so as to reduce transmission of off-axis emissions at a specific angle.

9. The method of claim 8 , wherein the VCSEL comprises a mesa structure, wherein the mesa structure comprises irregularities on walls of the mesa structure.

10. The method of claim 8 , further comprising an absorbing material disposed in the optical structure, the absorbing material comprising a composition configured to absorb optical emissions.

11. The method of claim 8 , further comprising an optical aperture between the VCSEL and photodiode to block a portion of off-axis spontaneous emissions.

12. The method of claim 8 , wherein at least one of the top DBR mirror and the bottom DBR mirror is optimized to decrease the critical angle caused by an interface between the DBR mirror and the active region.

13. The method of claim 8 , wherein the photodiode comprises an increased bandgap to reduce responsivity of the photodiode above a predetermined laser emission wavelength.

14. The method of claim 8 , further comprising a wide bandgap layer coupled to the photodiode on a side of the photodiode opposite the VCSEL.

15. The method of claim 8 , wherein forming the DBR mirror further comprises:

forming the DBR mirror on the substrate such that the DBR mirror is interposed between the photodiode and the substrate.

16. A VCSEL-based optical structure, device, comprising:

a VCSEL including:

a top DBR mirror;

an active region coupled to the top DBR mirror; and

a bottom DBR mirror coupled to the top DBR mirror;

a photodiode coupled to the VCSEL; and

a DBR mirror positioned proximate the photodiode, the DBR mirror configured to limit reflection of off-axis light emissions from the VCSEL.

17. The VCSEL-based optical structure as defined in claim 16 , wherein the DBR mirror is positioned on a substrate, and wherein the photodiode is interposed between the DBR mirror and the VCSEL.

Assignments (4)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →