IP Library Granted Patent US 7,670,063
Granted Patent B2
US 7,670,063 · App. 11/026,439 · Granted Mar 2, 2010

Optical transceiver with variably positioned insert

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Quick Facts
Patent No.
US 7,670,063
App. No.
11/026,439
Granted
Mar 2, 2010
Kind
B2
Abstract

An optical transceiver includes a transceiver housing configured to receive an optical sub-assembly insert. The optical sub-assembly insert includes duplex cavities configured to hold a transmit optical sub-assembly front end and a receive optical sub-assembly front end in a fixed spatial orientation for a given optical connector interface. The optical sub-assembly insert is configurable to fit inside a transceiver housing with a relatively wide range of X and Y dimensional tolerance. In one implementation, the X-Y position of the optical sub-assembly insert is dictated by the position of the transmit optical-sub assembly front end after its corresponding back end has been mounted to a heat dissipation element. Any gaps that form between the optical sub-assembly insert and the inside surface of the transceiver housing as a result of the transmit optical sub-assembly position can be accommodated with filler material.

Claims (40)

1. A fiber optic transceiver having thermally conductive properties comprising:

a transceiver module including one or more fiber optic receptacles, the one or more fiber optic receptacles each having an inner cavity;

an OSA having a back end and a front end, the back end being mounted to a thermal spreader in contact with a transceiver housing at the transceiver module;

a housing insert, the housing insert having an inner dimension that allows the housing insert to encompass a portion of the OSA and an outer dimension that abuts a portion of a fiber optic receptacle inner cavity.

2. The fiber optic receptacle of claim 1 , wherein the housing insert comprises one or more ribs radiating from a body of the housing insert, the insert comprising a flexible material.

3. The fiber optic receptacle of claim 1 , wherein the OSA is electrically coupled to the transceiver substrate through one or more of a flex circuit, a direct electrical mount, and a plug.

4. The fiber optic receptacle of claim 1 , wherein the OSA includes a main body that comprises one or more cylindrical shells, the housing insert fitting against one or more tangential points of at least one of the one or more cylindrical shells.

5. The fiber optic receptacle of claim 1 , wherein the housing insert is fixed to the transceiver housing with a thermally conductive adhesive, the housing insert being fixed to the transceiver housing after the OSA back end has been mounted to the thermal spreader.

6. The fiber optic receptacle of claim 1 , wherein the transceiver substrate is a printed circuit board having active circuitry.

7. The fiber optic receptacle of claim 1 , wherein the transceiver housing has walls that are approximately 20 mils thick, and the housing insert has walls that are approximately 20 mils thick.

8. The fiber optic receptacle of claim 1 , wherein the OSA includes a thermally-conductive extension, and wherein the OSA is connected to the heat spreader via the thermally-conductive extension.

9. The fiber optic receptacle of claim 8 , wherein the thermally-conductive extension extends from within the OSA out of the OSA back end.

10. The fiber optic receptacle of claim 1 , wherein the housing insert includes a formation for a standard fiber optic connector.

11. The fiber optic receptacle of claim 10 , wherein the housing for the standard fiber optic connector is configured as an LC connector.

12. The fiber optic receptacle of claim 1 , wherein the housing insert is configured to move within the fiber optic receptacle inner cavity to accommodate a position of the OSA front end.

13. A method of manufacturing a fiber optic transceiver comprising:

mounting an OSA back end to a thermal spreader;

mounting at least a portion of the OSA within a flexible housing insert, wherein the portion of the OSA within the flexible housing insert is aligned to the OSA back end;

mounting the flexible housing insert within a fiber optic receptacle of the transceiver housing such that the flexible housing insert flexes to accommodate a position of the portion of the OSA within the fiber optic receptacle; and

mounting the OSA back end to the thermal spreader prior to aligning an OSA front end within the transceiver housing.

14. The method as recited in claim 13 , further comprising mounting the thermal spreader to the transceiver prior to mounting the OSA back end to the thermal spreader.

15. A method of manufacturing a fiber optic transceiver comprising:

mounting an OSA back end to a thermal spreader;

mounting at least a portion of the OSA within a flexible housing insert, wherein the portion of the OSA within the flexible housing insert is aligned to the OSA back end;

mounting the flexible housing insert within a fiber optic receptacle of the transceiver housing such that the flexible housing insert flexes to accommodate a position of the portion of the OSA within the fiber optic receptacle; and

electrically coupling the OSA to a transceiver substrate.

16. The method as recited in claim 15 , wherein the transceiver substrate has been mounted to the transceiver prior to electrically coupling the OSA with the transceiver substrate.

17. A method of manufacturing a fiber optic transceiver comprising:

mounting an OSA back end to a thermal spreader;

mounting at least a portion of the OSA within a flexible housing insert, wherein the portion of the OSA within the flexible housing insert is aligned to the OSA back end;

mounting the flexible housing insert within a fiber optic receptacle of the transceiver housing such that the flexible housing insert flexes to accommodate a position of the portion of the OSA within the fiber optic receptacle; and

adhering the flexible housing insert within a fiber optic receptacle formed within the transceiver housing.

18. The method as recited in claim 17 , wherein a distance of approximately 10 mils separates an outer dimension of the flexible housing insert and an inner dimension of the fiber optic receptacle.

19. In a system where a position of an optical sub-assembly front end varies in relation to a position of the optical sub-assembly back end from one optical sub-assembly to another, a fiber optic transceiver that uses a uniformly-sized heat spreader for a given optical sub-assembly, the fiber optic transceiver comprising:

a transceiver module having a fiber optic receptacle, the fiber optic receptacle having an inner cavity;

a heat spreader connected to the transceiver module and configured to connect with a back end of an optical sub-assembly; and

a housing insert that receives a front end of the optical sub-assembly and is positioned within the inner cavity of the fiber optic receptacle, wherein the housing insert is movable within the inner cavity to accommodate a position of the front end of the optical sub-assembly within the inner cavity, wherein at least a portion of the housing insert compresses against a wall of the inner cavity to accommodate a position of the optical sub-assembly front end.

20. The system of claim 19 , wherein the housing insert comprises one or more ribs radiating from a body of the housing insert, the insert comprising a flexible material.

21. The system of claim 19 , wherein the optical sub-assembly includes a main body that comprises one or more cylindrical shells, the housing insert fitting against one or more tangential points of at least one of the one or more cylindrical shells.

22. The system of claim 19 , wherein the housing insert is fixed to the transceiver housing with a thermally conductive adhesive, the housing insert being fixed to the transceiver housing after the optical sub-assembly back end has been mounted to the thermal spreader.

Assignments (4)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →