Electronic device including a guest material within a layer and a process for forming the same

1. A process for forming an electronic device comprising:

forming a first layer over a substrate; and

placing a first liquid composition over a first portion of the first layer, wherein the first liquid composition comprises at least a first guest material and a first liquid medium, wherein the first liquid composition comes in contact with the first layer and a substantial amount of the first guest material intermixes with the first layer to form an intermixed region where said contact occurs, wherein the intermixed region is thicker than the first layer as originally formed at the same location as the intermixed region wherein, the first layer is (1) capable of emitting radiation having an emission maximum at a targeted wavelength or within a targeted spectrum of wavelengths or (2) designed to respond to radiation at the targeted wavelength or within the targeted spectrum of wavelengths, wherein the targeted spectrum has a width no greater than 150 nm; and wherein the first guest material is (1) capable of emitting radiation having an emission maximum at a targeted wavelength or a targeted spectrum of wavelengths or (2) designed to respond to radiation at the targeted wavelength or within the targeted spectrum of wavelengths.

2. The process of claim 1 , wherein each of the first layer and the first guest material has an emission maximum within a blue light spectrum.

3. The process of claim 1 , further comprising:

forming a second layer over the substrate before forming the first layer; and

densifying at least part of the second layer,

wherein the first layer is formed over the second layer after densifying.

4. The process of claim 3 , wherein the first and second layers have substantially a same composition.

5. The process of claim 3 , wherein the second layer substantially prevents the first guest material from intermixing with the substrate.

6. The process of claim 3 , wherein densifying comprises cross-linking the second layer.

7. The process of claim 6 , further comprising cross-linking the first layer, wherein:

the first layer comprises a first material;

the second layer comprises a second material;

cross-linking the first layer is performed such that some, but not all, of the first material is cross-linked; and

cross-linking the second material is performed at least until substantially all of the second material is cross-linked.

8. The process of claim 1 , further comprising:

placing a second liquid composition over a second portion of the first layer, wherein the second liquid composition comprises at least a second guest material and a second liquid medium, wherein:

the second guest material is different from the first guest material; and

the second liquid composition comes in contact with the first layer and a substantial amount of the second guest material intermixes with the first layer to form an intermixed region where said contact occurs, wherein the intermixed region is thicker than the first layer as originally formed at the same location as the intermixed region; and

placing a third liquid composition over a third portion of the first layer, wherein the third liquid composition comprises at least a third guest material and a third liquid medium, wherein:

the third guest material is different from each of the first and second guest materials; and

the third liquid composition comes in contact with the first layer and a substantial amount of the third guest material intermixes with the first layer to form an intermixed region where said contact occurs, wherein the intermixed region is thicker than the first layer as originally formed at the same location as the intermixed region.

9. The process of claim 8 , wherein:

the first layer, as formed, has a thickness no greater than 40 nm;

a first combination of the first layer and the first guest material has a thickness of at least 60 nm;

a second combination of the first layer and the second guest material has a thickness of at least 60 nm; and

a third combination of the first layer and the third guest material has a thickness of at least 60 nm.

10. The process of claim 1 , wherein substantially all of the first guest material intermixes with the first layer.

11. The process of claim 1 , wherein forming the first layer comprises forming a continuous layer.

12. The process of claim 1 further comprising:

placing a second liquid composition over a second portion of the first layer, wherein the second liquid composition comprises at least a second guest material and a second liquid medium, wherein the second liquid composition comes in contact with the first layer and a substantial amount of the second guest material intermixes with the first layer to form an intermixed region where said contact occurs, wherein the intermixed region is thicker than the first layer as originally formed at the same location as the intermixed region;

the second guest material is (1) capable of emitting radiation having an emission maximum at the targeted wavelength or a targeted spectrum of wavelengths or (2) designed to respond to radiation at the targeted wavelength or within the targeted spectrum of wavelengths;

and the first and second guest materials comprise different materials.

13. The process of claim 1 wherein the first layer comprises a material capable of emitting blue light.

14. The process of claim 9 wherein the first, second and third combinations have thicknesses within 10 nm of each other.

15. The process of claim 1 wherein placing the first liquid composition over a first portion of the first layer is performed using a precision deposition technique.