Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate
View Patent ↗A connecting member between wiring films is provided in which: a normal copper foil, which is a general-purpose component and not expensive, or the like can be used as a material; formation of bumps is sufficiently achieved by conducting etching one time; and a necessary number of layers can be laminated and pressed collectively at a time. Bumps, which are formed approximately in a cone-shape, for connecting wiring films of a multilayer wiring substrate are embedded in a second resin film that serves as an interlayer insulating film.
1. A method of manufacturing a multilayer substrate having exposed metal films on exterior surfaces thereof, comprising:
providing a metal layer;
etching the metal layer to form conductive bumps;
assembling the etched conductive bumps with an insulating film having a first major surface and a second major surface remote from the first major surface, the metal bumps having first ends at least exposed at the first major surface and second ends at least exposed at the second major surface;
arranging a substantially continuous first metal sheet adjacent to the first major surface of the insulating film and the first ends of the metal bumps;
arranging a substantially continuous second metal sheet adjacent to the second major surface of the insulating film and the second ends of the metal bumps; and
applying at least pressure in a direction between the first and second metal sheets to simultaneously metallically bond the first and second metal sheets directly to the metal bumps.
2. The method as claimed in claim 1 , wherein the metal bumps consist essentially of copper and the first and second metal sheets consist essentially of copper.
3. The method as claimed in claim 1 , wherein the metal bumps have cone shape.
4. The method as claimed in claim 1 , further comprising patterning at least one of the first metal sheet or second metal sheet into wiring patterns after the first and second metal sheets are bonded to the metal bumps.
5. The method as claimed in claim 1 , wherein, prior to the first and second metal sheets being bonded to the metal bumps, at least second ends of the bumps protrude from the insulating film beyond the second major surface.
6. The method as claimed in claim 5 , wherein each of the metal bumps has a base and an end remote from the base, wherein, prior to the first and second metal sheets being bonded to the bumps, the bases of the metal bumps are exposed at the first major surface and the ends of the metal bumps protrude beyond the second major surface.
7. The method as claimed in claim 5 , wherein each of the metal bumps has a base and an end remote from the base, wherein, prior to the first and second metal sheets being bonded to the metal bumps, the ends of the metal bumps are exposed at the second major surface and the bases of the metal bumps protrude beyond the first major surface.
8. The method as claimed in claim 5 , wherein each of the metal bumps has a base and an end remote from the base, wherein, prior to the first and second metal sheets being bonded to the metal bumps, the ends of some of the metal bumps are at least exposed at the first major surface and the ends of some others of the metal bumps are at least exposed at second major surface.