Circuit interconnect for optoelectronic device
View Patent ↗This disclosure concerns systems and devices configured to implement impedance matching schemes in a high speed data transmission environment. In one example, an optoelectronic assembly is provided that includes a TO package having a base through which one or more leads pass. The leads are electrically coupled to an optoelectronic device in the TO package, and are electrically isolated from the base. Some or all of the leads include a ground ring that is electrically isolated from the lead and electrically coupled with the base. A circuit interconnect is also included that is electrically coupled to the optoelectronic device and the TO package. The circuit interconnect includes a dielectric substrate having signal traces that are electrically coupled to the signal leads. A ground signal conductor disposed on the dielectric substrate is electrically coupled with the ground rings.
1. An optoelectronic assembly, comprising:
a transistor outline (TO) package, including:
a base;
a plurality of leads passing through the base; and
a plurality of ground rings, each of which is disposed about a corresponding lead and is electrically coupled with the base, and each ground ring being electrically isolated from the respective corresponding lead;
an optoelectronic device disposed in the TO package and electrically coupled with at least one lead;
a circuit interconnect electrically coupled to the optoelectronic device and the TO package, the circuit interconnect comprising:
a dielectric substrate;
a plurality of signal traces disposed on the dielectric substrate, each of the signal traces being electrically coupled with a corresponding lead of the TO package; and
a ground signal conductor disposed on the dielectric substrate and electrically coupled with the ground rings.
2. The optoelectronic assembly as recited in claim 1 , wherein the plurality of leads includes a power lead and a signal lead.
3. The optoelectronic assembly as recited in claim 1 , wherein the plurality of leads includes a plurality of signal leads, each of which has one of the ground rings disposed thereabout.
4. The optoelectronic assembly as recited in claim 1 , wherein the optoelectronic device comprises one of a detector; and, a light source.
5. The optoelectronic assembly as recited in claim 1 , wherein the dielectric substrate substantially comprises a flexible material.
6. The optoelectronic assembly as recited in claim 1 , wherein the circuit interconnect defines a plurality of openings, each of which receives a corresponding lead of the TO package, the leads being electrically isolated from the ground signal conductor of the circuit interconnect.
7. The optoelectronic assembly as recited in claim 1 , wherein each lead of the TO package physically contacts a corresponding signal trace.
8. The optoelectronic assembly as recited in claim 1 , wherein the plurality of ground rings comprise respective raised annular regions of the base.
9. The optoelectronic assembly as recited in claim 1 , further comprising electrical circuitry electrically coupled with the plurality of signal traces, and the electrical circuitry including a ground node to which the ground signal conductor is electrically coupled.
10. The optoelectronic assembly as recited in claim 9 , wherein an impedance of the circuit interconnect is within a factor of about 1.25 to about 1.5 of: an impedance associated with the TO package; and, an impedance of the electrical circuitry.
11. An optoelectronic assembly, comprising:
a transistor outline (TO) package, including:
a base;
a plurality of leads passing through the base; and
a plurality of ground rings, each of which is disposed about a corresponding lead and is electrically coupled with the base;
a dielectric interposed between each ground ring and corresponding lead;
an optoelectronic device disposed in the TO package and electrically coupled with a plurality of leads;
a circuit interconnect electrically coupled to the optoelectronic device and the TO package, the circuit interconnect comprising:
a dielectric substrate;
a plurality of signal traces disposed on the dielectric substrate, each of the signal traces being electrically coupled with a corresponding lead of the TO package; and
a ground signal conductor disposed on the dielectric substrate and electrically coupled with the ground rings; and
electrical circuitry electrically coupled with the plurality of signal traces, and the electrical circuitry including a ground node to which the ground signal conductor is electrically coupled.
12. The optoelectronic assembly as recited in claim 11 , wherein the plurality of leads includes a power lead and a signal lead.
13. The optoelectronic assembly as recited in claim 11 , wherein the plurality of leads includes a plurality of signal leads, each of which has one of the ground rings disposed thereabout.
14. The optoelectronic assembly as recited in claim 11 , wherein the optoelectronic device comprises one of a detector; and, an optical transmitter.
15. The optoelectronic assembly as recited in claim 11 , wherein the dielectric substrate substantially comprises one of polyimide; or, polyester.
16. The optoelectronic assembly as recited in claim 11 , wherein the dielectrics disposed about the signal leads substantially comprise glass.
17. The optoelectronic assembly as recited in claim 11 wherein, for leads about which both a ground ring and dielectric are disposed, the dielectric is interposed between the lead and the ground ring.
18. The optoelectronic assembly as recited in claim 11 , wherein the ground signal conductor physically contacts the base of the TO package.
19. The optoelectronic assembly as recited in claim 11 , wherein at least one of the plurality of signal traces is disposed on a side of the dielectric substrate opposite a side of the dielectric substrate upon which the ground signal conductor is disposed.
20. The optoelectronic assembly as recited in claim 11 , wherein the circuit interconnect defines a plurality of openings, each of which receives a corresponding lead of the TO package, the leads being electrically isolated from the ground signal conductor of the circuit interconnect.
21. The optoelectronic assembly as recited in claim 11 , wherein each lead of the TO package physically contacts a corresponding signal trace.
22. The optoelectronic assembly as recited in claim 11 , wherein an impedance of the circuit interconnect is within a factor of about 1.25 to about 1.5 of: an impedance associated with the TO package; and, an impedance of the electrical circuitry.