IP Library Granted Patent US 7,340,209
Granted Patent B2
US 7,340,209 · App. 11/030,974 · Granted Mar 4, 2008

Fusing device with rough surface and method for manufacturing the fusing member

Assignee: Oki Data Corporation
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Quick Facts
Patent No.
US 7,340,209
App. No.
11/030,974
Granted
Mar 4, 2008
Kind
B2
Abstract

To improve image quality upon preventing abrasion traces from strongly forming on a surface of a fusing member, an invented fusing device has a pressure member, a fusing member movably arranged as faced with the pressure member, and a contact element arranged in contact with an outer circumferential surface of the fusing member, with the surface roughness of the fusing member of 1.0 to 4.0 [μm]. When the fusing member is moved in contact with the contact element, the contact element rubs a surface of the fusing member, but in the fusing member, the portion in contact with the contact element and the portion not in contact with the contact element become about equal in the surface roughness with the above surface roughness.

Claims (12)

1. A fusing device comprising:

a pressure member;

a fusing member movably arranged facing said pressure member and heated with heat generated by a heating element; and

a contact element arranged in contact with a medium transmission area on an outer circumferential surface of said fusing member,

wherein said fusing member has a surface roughness set to 1.0 to 4.0 μm,

wherein said contact element produces a surface roughness of 1.0 to 4.0 μm when rubbed in contact with the fusing member, whereby gloss unevenness caused by a trace of the contact element is reduced in the printed results.

2. The fusing device according to claim 1 , wherein said fusing member is a fusing roller or a fusing belt.

3. The fusing device according to claim 1 , wherein said contact element is a thermal detecting member for detecting the surface temperature of the fusing member.

4. The fusing device according to claim 1 , wherein the surface roughness of said fusing member is preferably set to 1.5 to 3.5 μm.

5. The fusing device according to claim 1 , wherein said fusing member is formed upon applying a resin onto a surface thereof.

6. The fusing device according to claim 1 , wherein said fusing member is covered with a resin made tube.

7. The fusing device according to claim 1 , and further comprising a heating element for heating said pressure member.

Assignments (2)
MERGER Recorded Mar 14, 2022
From: OKI DATA CORPORATION
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 059365/0145 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2005
From: ARAMATA, SUMIO; SUNAGA, NAOKI; SAKAI, MASATO
To: OKI DATA CORPORATION
Reel/Frame 016166/0530 →
Priority Claims (1)
JP 2004-008234 · Jan 15, 2004 · national
Continuity (1)
Related Publication 20050163541A1 · Jul 28, 2005