Poly(arylene ether) adhesive compositions
View Patent ↗A laminate, comprises a thermoplastic substrate, a conductive metal foil at least partially disposed on at least one side of the substrate, and an adhesive disposed between the substrate and the metal foil. The adhesive includes a blend of a poly(arylene ether), a thermosetting resin, a toughening agent, a plasticizer, and a cure agent. The laminate finds particular utility in circuit board applications.
1. A laminate, comprising:
a thermoplastic substrate;
a conductive metal foil at least partially disposed on at least one side of the substrate; and
an adhesive disposed between the substrate and the metal foil, wherein the adhesive is formed from a composition comprising, based on 100 weight percent of the resin portion of the composition
about 5 to about 50 weight percent of a poly(arylene ether) resin having a number average molecular weight of about 8,000 to about 13,000;
about 50 to about 90 weight percent of a thermosetting resin selected from the group consisting of cyanate esters, polyesters, epoxy, benzoxazines, benzocyclobutene resins, and mixtures thereof;
about 0.5 to about 15 weight percent of a toughening agent selected from the group consisting of poly(vinyl butyral-co-vinyl acetate) resins and partially hydrolyzed poly(vinyl butyral-co-vinyl acetate) resins; and
about 0.1 to about 7 weight percent of a cure agent.
2. The laminate of claim 1 , wherein the poly(arylene ether) resin comprises a plurality of structural units of the formula (I);
wherein for each structural unit, each Q 1 is independently halogen, primary or secondary lower alkyl having up to about 7 carbon atoms, phenyl, haloalkyl, aminoalkyl, hydrocarbonoxy, or halohydrocarbonoxy wherein at least two carbon atoms separate the halogen and oxygen atoms; and each Q 2 is independently hydrogen, halogen, primary or secondary lower alkyl having up to 7 carbon atoms, phenyl, haloalkyl, hydrocarbonoxy or halohydrocarbonoxy wherein at least two carbon atoms separate the halogen and oxygen atoms.
3. The laminate of claim 1 , wherein the poly(arylene ether) resin has a number average molecular weight of about 9,000 to about 12,000.
4. The adhesive of claim 1 wherein the poly(arylene ether) is a homopolymer comprising 2,6-dimethylphenylene ether units, or a random copolymer comprising 2,6-dimethylphenylene ether units in combination with 2,3,6-trimethyl-1,4-phenylene ether units.
5. The laminate of claim 1 , wherein the thermosetting resin comprises an epoxy.
6. The laminate of claim 5 , wherein the epoxy is a condensation product of a bisphenol polyglycidyl ether and a bromine-substituted bisphenol.
7. The laminate of claim 5 , wherein the epoxy is the reaction product of tetrabromobisphenol A and the diglycidyl ether of bisphenol A or bisphenol F, the reaction product having an average of at most one aliphatic hydroxy group per molecule, and the reaction product comprising about 10 to about 30 weight percent bromine as aryl substituents.
8. The laminate of claim 5 , wherein the cure agent comprises an imidazole or an arylene polyamine.
9. The laminate of claim 1 , wherein the thermosetting resin comprises a cyanate ester.
10. The laminate of claim 1 , wherein the thermosetting resin comprises a polyester.
11. The laminate of claim 1 , wherein the thermosetting resin comprises a benzoxazine or benzocyclobutene resin.
12. The laminate of claim 1 , wherein the thermosetting resin comprises an epoxy and a cyanate ester.
13. The laminate of claim 1 , wherein the toughening agent is present at 1 to 15 weight percent of the total composition solids.
14. A method for forming a laminate comprising:
coating a surface of a thermoplastic or metalized thermoplastic or conductive metal foil with an adhesive comprising, based on 100 weight percent of the resin portion of the composition:
about 5 to about 50 weight percent of a poly(arylene ether) resin having a number average molecular weight of about 8,000 to about 13,000;
about 50 to about 90 weight percent of a thermosetting resin selected from the group consisting of cyanate esters, polyesters, epoxy, benzoxazines, benzocyclobutene resins, and mixtures thereof;
about 0.5 to about 15 weight percent of a toughening agent selected from the group consisting of poly(vinyl butyral-co-vinyl acetate) resins and partially hydrolyzed poly(vinyl butyral-co-vinyl acetate) resins; and
about 0.1 to about 7 weight percent of a cure agent; and
applying the adhesive against a first surface of a thermoplastic substrate.
15. The method of claim 14 , further comprising partially curing the adhesive prior to applying the adhesive against the substrate.
16. The method of claim 14 , wherein the thermosetting resin comprises an epoxy.
17. The method of claim 16 , wherein the cure agent comprises an imidazole or an arylene polyamine.
18. A method for forming a laminate comprising:
coating a surface of a thermoplastic or metalized thermoplastic or conductive metal foil with an adhesive comprising, based on 100 weight percent of the resin portion of the composition
about 5 to about 50 weight percent of a poly(arylene ether) resin having a number average molecular weight of about 8,000 to about 13,000;
about 50 to about 90 weight percent of a thermosetting resin selected from the group consisting of cyanate esters, polyesters, epoxy, benzoxazines, benzocyclobutene resins, and mixtures thereof; wherein the thermosetting resin comprises an epoxy; and
about 0.5 to about 15 weight percent of a toughening agent selected from the group consisting of poly(vinyl butyral-co-vinyl acetate) resins; and partially hydrolyzed poly(vinyl butyral-co-vinyl acetate) resins; and
about 0.1 to about 7 weight percent of a cure agent; and
applying the adhesive against a first surface of a thermoplastic substrate.
19. A laminate, comprising:
a thermoplastic substrate;
a conductive metal foil at least partially disposed on at least one side of the substrate; and
an adhesive disposed between the substrate and the metal foil, wherein the adhesive is formed from a composition comprising, based on 100 weight percent of the resin portion of the composition
about 5 to about 50 weight percent of a poly(arylene ether) resin having a number average molecular weight of about 8,000 to about 13,000;
about 50 to about 90 weight percent of a thermosetting resin selected from the group consisting of cyanate esters, polyesters, epoxy, benzoxazines, benzocyclobutene resins, and mixtures thereof;
about 0.5 to about 15 weight percent of a toughening agent comprising poly(vinyl butyral-co-poly-vinyl alcohol-co-polyvinyl acetate); and
about 0.1 to about 7 weight percent of a cure agent.
20. A method for forming a laminate comprising:
coating a surface of a thermoplastic or metalized thermoplastic or conductive metal foil with an adhesive comprising, based on 100 weight percent of the resin portion of the composition:
about 5 to about 50 weight percent of a poly(arylene ether) resin having a number average molecular weight of about 8,000 to about 13,000;
about 50 to about 90 weight percent of a thermosetting resin selected from cyanate esters, polyesters, epoxy, benzoxazines, benzocyclobutene resins, and mixtures thereof;
about 0.5 to about 15 weight percent of a toughening agent comprising poly(vinyl butyral-co-polyvinyl alcohol-co-polyvinyl acetate); and
about 0.1 to about 7 weight percent of a cure agent; and
applying the adhesive against a first surface of a thermoplastic substrate.