Branching filter package
View Patent ↗A branching filter package has a SAW filter chip housing area which houses a piezo electric base, on which a transmitting SAW filter and a receiving SAW filter having a different frequency passing band with each other, are formed, and an impedance matching circuit and a branching circuit for the transmitting SAW filter and the receiving SAW filter.
1. A surface acoustic wave (SAW) duplexer comprising:
a transmitting SAW filter having:
a plurality of first SAW resonators connected to a ground, and
an output portion;
a receiving SAW filter having:
a plurality of second SAW resonators connected to the ground, and
an input portion, wherein a number of the second SAW resonators is larger
than a number of the first SAW resonators;
a single piezoelectric substrate on which the transmitting and receiving SAW filters are formed;
a package base board on which the single piezoelectric substrate is mounted;
an antenna terminal formed on the package base board, wherein the antenna terminal is connected to the output portion of the transmitting SAW filter and the input portion of the receiving SAW filter;
an input terminal positioned on the package base board, the antenna terminal being electrically connected to the input portion of the receiving SAW filter through the input terminal of the package base board; and
an output terminal positioned on the package base board, the antenna terminal being electrically connected to the output portion of the transmitting SAW filter through the output terminal of the package base board,
wherein a distance between the input terminal and the output terminal of the package base board is greater than a distance between the output portion of the transmitting SAW filter and the input portion of the receiving SAW filter.
2. A surface acoustic wave duplexer according to claim 1 , wherein the output terminal of the package base board is positioned closer to the output portion of the transmitting SAW filter than the input portion of the receiving SAW filter, and wherein the input terminal of the package base board is positioned closer to the input portion of the receiving SAW filter than the output portion of the transmitting SAW filter.
3. The surface acoustic wave duplexer according to claim 2 , further comprising:
a first interconnection line which connects the input terminal of the package base board and the input portion of the receiving SAW filter; and
a second interconnection line which connects the output terminal of the package base board and the output portion of the transmitting SAW filter.
4. The surface acoustic wave duplexer according to claim 3 , wherein both of the first and second interconnection lines extend substantially parallel to one direction.
5. The surface acoustic wave duplexer according to claim 2 , wherein a direction from the output portion of the receiving SAW filter to the output terminal of the package base board is different than a direction from the input portion of the transmitting SAW filter to the input terminal of the package base board.
6. The surface acoustic wave duplexer according to claim 5 , wherein the directions are opposite to each other.
7. A surface acoustic wave duplexer, comprising:
a transmitting SAW filter having a plurality of first SAW resonators connected to a ground;
a receiving SAW filter having a plurality of second SAW resonators connected to the ground, wherein a number of the second SAW resonators is greater than a number of the first SAW resonators;
a single piezoelectric substrate on which the transmitting and receiving SAW filters are formed;
a package base board on which the single piezoelectric substrate is mounted;
an antenna terminal formed on the package base board, wherein the antenna terminal is connected to the transmitting and receiving SAW filters;
a plurality of sub package base boards constituting the package base board; and
a plurality of ground voltage patterns formed on one of the sub package base boards, the ground voltage patterns being electrically connected to the transmitting and receiving SAW filters.
8. A surface acoustic wave duplexer, comprising:
a transmitting SAW filter having a plurality of first SAW resonators connected to a ground;
a receiving SAW filter having a plurality of second SAW resonators connected to the ground, wherein a number of the second SAW resonators is greater than a number of the first SAW resonators;
a single piezoelectric substrate on which the transmitting and receiving SAW filters are formed;
a package base board on which the single piezoelectric substrate is mounted, wherein the package base board comprises a heat radiating opening that radiates heat generated from the transmitting and receiving SAW filters; and
an antenna terminal formed on the package base board, wherein the antenna terminal is connected to the transmitting and receiving SAW filters.
9. A surface acoustic wave (SAW) duplexer comprising:
a transmitting SAW filter having a first input portion, a first output portion, a ground portion and a plurality of first SAW resonators connected to the ground portion;
a receiving SAW filter having a second input portion, a second output portion, the ground portion and a plurality of second SAW resonators connected to the ground portion, and wherein a number of the second SAW resonators is larger than a number of the first SAW resonators;
a single piezoelectric substrate on which the transmitting and receiving SAW filters are arranged in series in an arranging direction, wherein the single piezoelectric substrate has first and second sides which face each other in an orthogonal direction, the orthogonal direction being orthogonal to the arranging direction;
a package base board on which the single piezoelectric substrate is mounted; and
an antenna terminal formed on the package base board, wherein the antenna terminal is connected to the first output portion and the second input portion,
wherein the first output portion of the transmitting SAW filter is positioned closer to the first side than the second side, and the second input portion of the receiving SAW filter is positioned closer to the second side than the first side.
10. The surface acoustic wave duplexer according to claim 9 , wherein the first output portion of the transmitting SAW filter is positioned in vicinity to the first side.
11. The surface acoustic wave duplexer according to claim 9 , wherein the second input portion of the receiving SAW filter is positioned in vicinity to the second side.
12. The surface acoustic wave duplexer according to claim 9 , wherein the first input portion of the transmitting SAW filter is positioned closer to the second side than the first side, and the second output portion of the receiving SAW filter is positioned closer to the first side than the second side.
13. The surface acoustic wave duplexer according to claim 9 , wherein the single piezoelectric substrate has third and fourth end portions which face each other in the arranging direction, and wherein the first output portion of the transmitting SAW filter is positioned closer to the third side than the fourth side, and the second input portion of the receiving SAW filter is positioned closer to the fourth side than the third side.
14. The surface acoustic wave duplexer according to claim 13 , wherein the first output portion of the transmitting SAW filter is positioned in vicinity to the third side.
15. The surface acoustic wave duplexer according to claim 13 , wherein the second input portion of the receiving SAW filter is positioned in vicinity to the fourth side.
16. The surface acoustic wave duplexer according to claim 13 , wherein the first input portion of the transmitting SAW filter is positioned closer to the second side than the first side, and the second output portion of the receiving SAW filter is positioned closer to the first side than the second side.