Photoelectric conversion module with cooling function
View Patent ↗A photoelectric conversion module with a cooling function has a semiconductor element to transmit/receive an optical signal, a stem to fix the semiconductor element, a cap to cover the semiconductor element, and a lead to apply an electrical signal to the semiconductor element or to transmit an electrical signal from the semiconductor element, wherein on the stem, there is provided a heat releasing device formed of a peltiert element, and a thermal conduction member for heat absorption and a thermal conduction member for heat release provided respectively on both sides of the peltiert element, and the semiconductor element is directly disposed on the thermal conduction member for heat absorption.
1. A photoelectric conversion module with a cooling function, comprising:
a device adapted to transmit or to receive an optical signal;
a stem to fix the device adapted to transmit or to receive an optical signal;
a cap to cover the device adapted to transmit or to receive an optical signal;
a lead to apply an electrical signal to the device adapted to transmit or to receive an optical signal or to transmit an electrical signal from the device adapted to transmit or to receive an optical signal, and
a heat releasing device disposed on the stem,
wherein the heat releasing device comprises:
a peltiert element;
a thermal conduction member for heat absorption disposed on one side of the peltiert element; and
a thermal conduction member for heat release disposed on another side of the peltiert element,
wherein the device adapted to transmit or to receive an optical signal is disposed on a side surface of the thermal conduction member for heat absorption.
2. The photoelectric conversion module with a cooling function according to claim 1 , wherein:
the peltiert element passes through the stem, and
the thermal conduction member for heat release is arranged outside a package formed on the stem and the cap.
3. The photoelectric conversion module with a cooling function according to claim 1 , wherein:
the device adapted to transmit or to receive an optical signal comprises:
an end-face light emitting-type semiconductor laser diode element;
wherein an optical axis of the device adapted to transmit or to receive an optical signal corresponds to a central axis of the stem.
4. The photoelectric conversion module with a cooling function according to claim 1 , wherein:
the heat releasing device is arranged on the stem so as to be offset from the center of the stem.
5. The photoelectric conversion module with a cooling function according to claim 1 , wherein:
the heat releasing device is arranged centrally on the stem, and
the device adapted to transmit or to receive an optical signal is disposed on an upper surface of the thermal conduction member for heat absorption.
6. The photoelectric conversion module with a cooling function according to claim 1 , wherein:
a monitoring semiconductor element adapted to monitor the optical signal is disposed on a plane different from the surface on which the device adapted to transmit or to receive an optical signal is disposed to face the device adapted to transmit or to receive an optical signal.
7. The photoelectric conversion module with a cooling function according to claim 1 , wherein:
a lead to supply a driving power to the peltiert element is bonded to the thermal conduction member for heat release.
8. The photoelectric conversion module with a cooling function according to claim 7 , wherein:
a pattern for soldering is formed on the thermal conduction member for heat release.
9. The photoelectric conversion module with a cooling function according to claim 1 , wherein:
the side surface of the thermal conduction member for heat absorption is normal to at least one of an upper surface and a lower surface of the peltiert element.
10. The photoelectric conversion module with a cooling function according to claim 1 , wherein:
the thermal conduction member for heat absorption has a top surface that is substantially normal to the side surface of the thermal conduction member for heat absorption.
11. The photoelectric conversion module with a cooling function according to claim 1 , wherein:
the side surface of the thermal conduction member for heat absorption lies on a plane that is substantially parallel to a longitudinal axis of the lead.
12. The photoelectric conversion module with a cooling function according to claim 1 , wherein:
the thermal conduction member for heat absorption is disposed on an upper surface of the peltiert element; and
the thermal conduction member for heat release is disposed on a lower surface of the peltiert element.
13. The photoelectric conversion module with a cooling function according to claim 1 , further comprising a photo diode monitor, wherein the device adapted to transmit or to receive an optical signal is not attached to a surface that is contiguous with a surface on which the photo diode monitor is mounted.
14. The photoelectric conversion module with a cooling function according to claim 1 , wherein, with respect to a direction normal to a direction in which the thermal conduction member for heat absorption is aligned with the thermal conduction member for heat release, the peltiert element is disposed between the thermal conduction member for heat absorption and the thermal conduction member for heat release.
15. The photoelectric conversion module with a cooling function according to claim 13 , wherein, with respect to a direction normal to a direction in which the thermal conduction member for heat absorption is aligned with the thermal conduction member for heat release, the peltiert element is disposed between the photo diode monitor and the device adapted to transmit or to receive an optical signal.
16. A photoelectric conversion module with a cooling function, comprising:
a device adapted to transmit or to receive an optical signal;
a stem to fix the device adapted to transmit or to receive an optical signal;
a cap to cover the device adapted to transmit or to receive an optical signal;
a lead to apply an electrical signal to the device adapted to transmit or to receive an optical signal or to transmit an electrical signal from the device adapted to transmit or to receive an optical signal, and
a heat releasing device disposed on the stem,
wherein the heat releasing device comprises:
a peltiert element;
a thermal conduction member for heat absorption disposed on one side of the peltiert element; and
a thermal conduction member for heat release disposed on another side of the peltiert element,
wherein the device adapted to transmit or to receive an optical signal is disposed on a side surface of the thermal conduction member for heat absorption through a sub-mount.
17. The photoelectric conversion module with a cooling function according to claim 16 , wherein:
the sub-mount is disposed on an upper surface of the thermal conduction member for heat absorption.
18. The photoelectric conversion module with a cooling function according to claim 17 , wherein:
the device adapted to transmit or to receive an optical signal is disposed on a side of the sub-mount.