IP Library Granted Patent US 7,710,691
Granted Patent B2
US 7,710,691 · App. 11/032,395 · Granted May 4, 2010

Three terminal magnetic sensor having an in-stack longitudinal biasing layer structure in the collector region and a pinned layer structure in the emitter region

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Quick Facts
Patent No.
US 7,710,691
App. No.
11/032,395
Granted
May 4, 2010
Kind
B2
Abstract

In one illustrative example, a three terminal magnetic sensor (TTM) suitable for use in a magnetic head has a sensor stack structure which includes a base region, a collector region, and an emitter region. A first barrier layer separates the emitter region from the base region, and a second barrier layer separates the collector region from the base region. A plurality of terminals of the TTM include a base lead coupled to the base region, a collector lead coupled to the collector region, and an emitter lead coupled to the emitter region. Preferably, the base region consists of a free layer structure so as to have a relatively small thickness. A pinned layer structure is made part of the emitter region. An in-stack longitudinal biasing layer (LBL) structure is formed in stack with the sensor stack structure and has a magnetic moment that is parallel to a sensing plane of the TTM for magnetically biasing the free layer structure. The in-stack LBL structure is made part of the collector region which also includes a layer of semiconductor material. In one variation, the emitter region has the in-stack LBL structure and the collector region has the pinned layer structure. The TTM may comprise a spin valve transistor (SVT), a magnetic tunnel transistor (MTT), or a double junction structure.

Claims (78)

1. A three terminal magnetic sensor (TTM), comprising:

a sensor stack structure comprising a base region, a collector region, and an emitter region;

a first barrier layer located between the emitter region and the base region;

a second barrier layer located between the collector region and the base region;

a plurality of terminals of the TTM comprising a base lead coupled to the base region, a collector lead coupled to the collector region, and an emitter lead coupled to the emitter region;

the collector region comprising a layer of semiconductor material;

the base region being made of ferromagnetic materials and comprising a free layer structure;

one of the emitter region and the collector region comprising a pinned layer structure;

the other one of the emitter region and the collector region comprising an in-stack longitudinal biasing layer structure;

the in-stack longitudinal biasing layer structure comprising a first ferromagnetic (FM) pinned layer and a first antiferromagnetic (AFM) pinning layer which magnetically pins the first FM pinned layer;

the in-stack longitudinal biasing layer structure being formed in stack with the sensor stack structure and having a magnetic moment that is parallel to a sensing plane of the TTM for longitudinally biasing the free layer structure;

the pinned layer structure including a second FM pinned layer and a second AFM pinning layer which magnetically pins the second FM pinned layer;

an insulator layer which is offset from the sensing plane and in between the base region and the collector region; and

a layer of metal which is offset from the sensing plane and in contact with the ferromagnetic materials of the base region, the layer of metal having an electrical resistivity of less than 10 uΩ-centimeters so that a combined electrical resistivity of the base region is between about 2-18 uΩ-centimeters.

2. The TTM of claim 1 , wherein one of the barrier layers serves as a non-magnetic spacer layer between the free layer structure and the in-stack longitudinal biasing layer structure.

3. The TTM of claim 1 , wherein one of the barrier layers serves as a non-magnetic spacer layer between the free layer structure and the pinned layer structure.

4. The TTM of claim 1 , further comprising:

the first AFM pinning layer being formed of a first material; and

the second AFM pinning layer being formed of a second material that is not present in the first AFM pinning layer, so that the first and the second AFM pinning layers have different AFM pinning temperatures.

5. The TTM of claim 1 , further comprising:

the first AFM pinning layer being formed of a first thickness; and

the second AFM pinning layer being formed of a second thickness different from the first thickness, so that the first and the second AFM pinning layers have different AFM pinning temperatures.

6. The TTM of claim 1 , wherein the base region consists of the free layer structure.

7. A magnetic head, comprising;

a read sensor comprising a three terminal magnetic sensor (TTM);

the TTM having:

a sensor stack structure comprising a base region, a collector region, and an emitter region;

a first barrier layer located between the emitter region and the base region;

a second barrier layer located between the collector region and the base region;

a plurality of terminals of the TTM comprising a base lead coupled to the base region, a collector lead coupled to the collector region, and an emitter lead coupled to the emitter region;

the collector region comprising a layer of semiconductor material;

the base region being made of ferromagnetic materials and comprising a free layer structure;

one of the emitter region and the collector region comprising a pinned layer structure;

the other one of the emitter region and the collector region comprising an in-stack longitudinal biasing layer structure;

the in-stack longitudinal biasing layer structure comprising a first ferromagnetic (FM) pinned layer and a first antiferromagnetic (AFM) pinning layer which magnetically pins the first FM pinned layer;

the in-stack longitudinal biasing layer structure being formed in stack with the sensor stack structure and having a magnetic moment that is parallel to a sensing plane of the TTM for longitudinally biasing the free layer structure;

the pinned layer structure including a second FM pinned layer and a second AFM pinning layer which magnetically pins the second FM pinned layer;

an insulator layer which is offset from the sensing plane and in between the base region and the collector region; and

a layer of metal which is offset from the sensing plane and in contact with the ferromagnetic materials of the base region, the layer of metal having an electrical resistivity of less than 10 uΩ-centimeters so that a combined electrical resistivity of the base region is between about 2-18 uΩ-centimeters.

8. The magnetic head of claim 7 , wherein one of the barrier layers serves as a non-magnetic spacer layer between the free layer structure and the in-stack longitudinal biasing layer structure.

9. The magnetic head of claim 7 , wherein one of the barrier layers serves as a non-magnetic spacer layer between the free layer structure and the pinned layer structure.

10. The magnetic head of claim 7 , further comprising:

the first AFM pinning layer being formed of a first material; and

the second AFM pinning layer being formed of a second material that is not present in the first AFM pinning layer, so that the first and the second AFM pinning layers have different AFM pinning temperatures.

11. The magnetic head of claim 7 , further comprising:

the first AFM pinning layer being formed of a first thickness; and

the second AFM pinning layer being formed of a second thickness different from the first thickness, so that the first and the second AFM pinning layers have different AFM pinning temperatures.

12. The magnetic head of claim 10 , wherein the first material comprises one of PtMn and IrMn, and the second material comprises the other of PtMn and IrMn.

13. The magnetic head of claim 7 , wherein the base region consists of the free layer structure.

14. A disk drive, comprising:

a slider;

a magnetic head carried on the slider;

a write head portion of the magnetic head;

a read head portion of the magnetic head;

the read head portion including a three terminal magnetic sensor (TTM);

the TTM having:

a sensor stack structure comprising a base region, a collector region, and an emitter region;

a first barrier layer located between the emitter region and the base region;

a second barrier layer located between the collector region and the base region;

a plurality of terminals of the TTM comprising a base lead coupled to the base region, a collector lead coupled to the collector region, and an emitter lead coupled to the emitter region;

the collector region comprising a layer of semiconductor material;

the base region being made of ferromagnetic materials and comprising a free layer structure;

one of the emitter region and the collector region comprising a pinned layer structure;

the other one of the emitter region and the collector region comprising an in-stack longitudinal biasing layer structure;

the in-stack longitudinal biasing layer structure comprising a first ferromagnetic (FM) pinned layer and a first antiferromagnetic (AFM) pinning layer which magnetically pins the first FM pinned layer;

the in-stack longitudinal biasing layer structure being formed in stack with the sensor stack structure and having a magnetic moment that is parallel to a sensing plane of the TTM for longitudinally biasing the free layer structure;

the pinned layer structure including a second FM pinned layer and a second AFM pinning layer which magnetically pins the second FM pinned layer;

an insulator layer which is offset from the sensing plane and in between the base region and the collector region; and

a layer of metal which is offset from the sensing plane and in contact with the ferromagnetic materials of the base region, the layer of metal having an electrical resistivity of less than 10 uΩ-centimeters so that a combined electrical resistivity of the base region is between about 2-18 uΩ-centimeters.

15. The disk drive of claim 14 , wherein one of the barrier layers serves as a non-magnetic spacer layer between the free layer structure and the in-stack longitudinal biasing layer structure.

16. The disk drive of claim 14 , wherein one of the barrier layers serves as a non-magnetic spacer layer between the free layer structure and the pinned layer structure.

17. The disk drive of claim 14 , further comprising:

the first AFM pinning layer being formed of a first material; and

the second AFM pinning layer being formed of a second material that is not present in the first AFM pinning layer, so that the first and the second AFM pinning layers have different AFM pinning temperatures.

18. The disk drive of claim 14 , further comprising:

the first AFM pinning layer being formed of a first thickness; and

the second AFM pinning layer being formed of a second thickness different from the first thickness, so that the first and the second AFM pinning layers have different AFM pinning temperatures.

19. The disk drive of claim 17 , wherein the first material comprises one of PtMn and IrMn, and the second material comprises the other of PtMn and IrMn.

Assignments (4)
RELEASE OF SECURITY INTEREST AT REEL 052915 FRAME 0566 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 059127/0001 →
SECURITY INTEREST Recorded Feb 6, 2020
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 052915/0566 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 5, 2016
From: HGST NETHERLANDS B.V.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 040819/0450 →
CHANGE OF NAME Recorded Oct 25, 2012
From: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
To: HGST NETHERLANDS B.V.
Reel/Frame 029341/0777 →