IP Library Granted Patent US 7,418,995
Granted Patent B2
US 7,418,995 · App. 11/035,574 · Granted Sep 2, 2008

System for cooling environmentally sealed enclosures

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Quick Facts
Patent No.
US 7,418,995
App. No.
11/035,574
Granted
Sep 2, 2008
Kind
B2
Abstract

A system for cooling an environmentally sealed enclosure. The system includes an air channel extending generally vertically from a top surface of the enclosure to a bottom surface of the enclosure, at least one interior heat sink forming a barrier between the air channel and an interior portion of the enclosure, a fan disposed in the air channel and adapted to force air to flow through the air channel, and a plenum proximate the air channel to duct exhaust air away from the enclosure, wherein air flowing through the air channel cools the enclosure. A method employs the system.

Claims (37)

1. A system for cooling an environmentally sealed enclosure, comprising:

an air channel extending between a first surface of the enclosure and a second, opposing surface of the enclosure;

at least one interior heatsink forming a barrier between the air channel and an interior portion of the enclosure;

an external heatsink mounted to the enclosure;

a fan disposed in the air channel and adapted to force air to flow through the air channel; and

a plenum proximate the air channel to duct exhaust air away from the enclosure, wherein air flowing through the air channel cools the enclosure.

2. The system of claim 1 wherein the plenum is adapted to direct the flowing air over the external heatsink.

3. The system of claim 1 wherein at least one of the interior heatsink and the external heatsink is black in color to increase heat radiation.

4. The system of claim 1 wherein the air channel comprises four sidewalls formed by four interior heatsinks.

5. The system of claim 1 wherein the fan is a tube-axial fan.

6. The system of claim 1 wherein the plenum is connected to ducting to exhaust the flowing air away from the enclosure.

7. The system of claim 1 wherein an air filter is disposed in the air channel to capture and retain contaminants in the flowing air.

8. The system of claim 1 , further comprising:

an air inlet disposed in the second surface of the enclosure proximate the air channel; and

an air outlet disposed in the first surface of the enclosure proximate the air channel,

wherein air flows into the inlet, through the air channel, and is exhausted through the outlet and the plenum to cool the enclosure.

9. A system for cooling an environmentally sealed enclosure, comprising:

an air channel extending generally vertically from a top surface of the enclosure to a bottom surface of the enclosure;

at least one interior heatsink forming a barrier between the air channel and an interior portion of the enclosure;

a fan disposed in the air channel and adapted to force air to flow through the air channel;

an air inlet disposed in the bottom surface of the enclosure proximate the air channel;

an air outlet disposed in the top surface of the enclosure proximate the air channel;

a rear heatsink mounted to a rear portion of the enclosure; and

a plenum proximate the air channel to duct exhaust air away from the enclosure,

wherein air flows into the inlet, through the air channel, is exhausted through the outlet, and is directed over the rear heatsink by the plenum to cool the enclosure.

10. The system of claim 9 wherein at least one of the interior heatsink and the rear heatsink is black in color to increase heat radiation.

11. The system of claim 9 wherein the air channel comprises four sidewalls formed by four interior heatsinks.

12. The system of claim 9 wherein the fan is a tube-axial fan.

13. The system of claim 9 wherein the plenum is connected to ducting to exhaust the flowing air away from the enclosure.

14. The system of claim 9 wherein an air filter is disposed in the air channel to capture and retain contaminants in the flowing air.

15. A method for cooling an environmentally sealed enclosure, comprising the steps of:

routing an air between a first surface of the enclosure and a second, opposing surface of the enclosure;

installing at least one interior heatsink in the air channel to form a barrier between the air channel and an interior port ion of the enclosure;

mounting a heatsink to an external portion of the enclosure;

forcing air to flow through the air channel; and

ducting exhaust air away from the enclosure, wherein air flowing through the air channel cools the enclosure.

16. The method of claim 15 , further comprising the step of directing flowing air over the externally-mounted heatsink.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Oct 7, 2015
From: JPMORGAN CHASE BANK, N.A.
To: VANNER, INC.; VANNER HOLDINGS, INC.
Reel/Frame 036748/0982 →
RELEASE OF SECURITY INTEREST Recorded Oct 2, 2015
From: HUNTINGTON CAPITAL INVESTMENT COMPANY II
To: VANNER, INC.; VANNER PARTNERS HOLDING, LLC; VANNER HOLDINGS, INC.; VHI HOLDING, INC.
Reel/Frame 036720/0177 →
SECURITY INTEREST Recorded Apr 10, 2014
From: VANNER, INC.; VANNER PARTNERS HOLDINGS, LLC; VANNER HOLDINGS, INC.
To: THE HUNTINGTON CAPITAL INVESTMENT COMPANY II
Reel/Frame 032643/0196 →
SECURITY AGREEMENT Recorded Feb 27, 2014
From: VANNER, INC.; VANNER HOLDINGS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 032366/0220 →